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MBC13720NT1 - NXP

Description: Low Noise Amplifier with Bypass switch

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PCB Footprints
MBC13720NT1 - NXP PCB footprint - SOT23 (6-Pin) - SOT23 (6-Pin) - SOT363
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3D Models
MBC13720NT1 - NXP  - 3D model - SOT23 (6-Pin) - SOT363
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MBC13720NT1 Details

  • Manufacturer Part Number:

    MBC13720NT1

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    ROHS COMPLIANT, ULTRA SMALL, PLASTIC, CASE 419B-01, SOT-363, 6 PIN

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Factory Lead Time:

    4 Weeks

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    0

  • Construction:

    COMPONENT

  • Gain:

    12 dB

  • Input Power-Max (CW):

    10 dBm

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Functions:

    1

  • Number of Terminals:

    6

  • Operating Frequency-Max:

    2400 MHz

  • Operating Frequency-Min:

    400 MHz

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -30 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Equivalence Code:

    TSSOP6,.08

  • Power Supplies:

    2.7 V

  • RF/Microwave Device Type:

    WIDE BAND LOW POWER

  • Surface Mount:

    YES

  • Technology:

    BICMOS

  • Terminal Finish:

    TIN

MBC13720NT1 Frequently Asked Questions (FAQs)

  • A good thermal design should include a solid ground plane, thermal vias, and a heat sink. The datasheet provides some guidelines, but a more detailed application note or a thermal simulation can help optimize the design.
  • Follow the guidelines in the datasheet for PCB layout, decoupling, and filtering. Additionally, consider using shielding, grounding, and filtering components to minimize electromagnetic interference (EMI).
  • NXP provides reliability data in the datasheet, but for specific applications, it's recommended to consult with NXP's reliability engineers or perform accelerated life testing to determine the expected lifespan.
  • The MBC13720NT1 is rated for operation up to 150°C. However, for high-temperature applications, consider using a heat sink, thermal interface materials, and ensuring good airflow to prevent overheating.
  • Use a systematic approach to troubleshoot, checking power supply, input/output signals, and thermal conditions. Consult the datasheet, application notes, and NXP's support resources for guidance.

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MBC13720NT1 Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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