Description:Low VF (Forward Voltage) of typical 350 mV @ IF = 10 mA; Extremely Fast Switching Speed; These Devices are Pb-Free, Halogen Free/BFR Free and are RoHS Compliant
HALOGEN FREE AND ROHS COMPLIANT, MINIATURE, CASE 419B-02, SC-88, 6 PIN
Pin Count:
6
Manufacturer Package Code:
419B-02
Country Of Origin:
Mainland China
ECCN Code:
EAR99
HTS Code:
8541.10.00.70
Factory Lead Time:
10 Weeks
Manufacturer:
onsemi
YTEOL:
6
Application:
FAST RECOVERY
Breakdown Voltage-Min:
30 V
Configuration:
SEPARATE, 2 ELEMENTS
Diode Element Material:
SILICON
Diode Type:
RECTIFIER DIODE
Forward Voltage-Max (VF):
1 V
JESD-30 Code:
R-PDSO-G6
JESD-609 Code:
e3
Moisture Sensitivity Level:
1
Non-rep Pk Forward Current-Max:
0.6 A
Number of Elements:
2
Number of Phases:
1
Number of Terminals:
6
Operating Temperature-Max:
125 °C
Output Current-Max:
0.2 A
Package Body Material:
PLASTIC/EPOXY
Package Shape:
RECTANGULAR
Package Style:
SMALL OUTLINE
Peak Reflow Temperature (Cel):
260
Power Dissipation-Max:
0.15 W
Qualification Status:
Not Qualified
Rep Pk Reverse Voltage-Max:
30 V
Reverse Current-Max:
2 µA
Reverse Recovery Time-Max:
0.005 µs
Reverse Test Voltage:
25 V
Surface Mount:
YES
Technology:
SCHOTTKY
Terminal Finish:
Matte Tin (Sn) - annealed
Terminal Form:
GULL WING
Terminal Position:
DUAL
Time@Peak Reflow Temperature-Max (s):
30
MBD54DWT1G Frequently Asked Questions (FAQs)
A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. The device should be placed near a thermal pad or heat sink to dissipate heat efficiently.
Ensure that the device is operated within the recommended voltage and current ratings, and that the PCB is designed to minimize thermal resistance. Also, consider using thermal management techniques such as heat sinks or thermal interfaces.
Use a multi-layer PCB with a solid ground plane, and ensure that the device is placed away from noise sources. Use shielding and filtering techniques, such as ferrite beads and capacitors, to reduce EMI and RFI.
Use the device's power-saving features, such as dynamic voltage and frequency scaling. Optimize the system's clock frequency and voltage to minimize power consumption. Also, consider using power gating and dynamic voltage scaling techniques.
Perform functional testing, including input/output voltage and current testing, and verify the device's performance across the entire operating temperature range. Also, perform reliability testing, such as temperature cycling and humidity testing, to ensure the device meets the required specifications.
Trust Checks
This model has been built in collaboration with the manufacturer.
Manufacturer Collaborated
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored
MBD54DWT1G Overview
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