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MBKK2012T1R0M - TAIYO YUDEN

Description: Fixed Inductors 0805 1uH 106mOhms +/-20% 1450mA HiCur

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PCB Footprints
MBKK2012T1R0M - TAIYO YUDEN PCB footprint - Other - Other - MBKK2012
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MBKK2012T1R0M Details

  • Manufacturer Part Number:

    MBKK2012T1R0M

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • ECCN Code:

    EAR99

  • HTS Code:

    8504.50.80.00

  • Factory Lead Time:

    8 Weeks

  • Manufacturer:

    TAIYO YUDEN

  • YTEOL:

    7

  • Case/Size Code:

    0805

  • Construction:

    Rectangular

  • Core Material:

    METAL CORE

  • DC Resistance:

    0.106 Ω

  • Inductance-Nom (L):

    1 µH

  • Inductor Application:

    POWER INDUCTOR

  • Inductor Type:

    GENERAL PURPOSE INDUCTOR

  • JESD-609 Code:

    e3

  • Number of Functions:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Height:

    1 mm

  • Package Length:

    2 mm

  • Package Style:

    SMT

  • Package Width:

    1.25 mm

  • Packing Method:

    TR, EMBOSSED, 7 INCH

  • Rated Current-Max:

    1.45 A

  • Shape/Size Description:

    RECTANGULAR PACKAGE

  • Shielded:

    NO

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Placement:

    DUAL ENDED

  • Terminal Shape:

    WRAPAROUND

  • Test Frequency:

    1 MHz

  • Tolerance:

    20%

MBKK2012T1R0M Frequently Asked Questions (FAQs)

  • The recommended land pattern for the MBKK2012T1R0M is a rectangular pad with a size of 2.5mm x 1.3mm, with a solder mask clearance of 0.2mm.
  • Yes, the MBKK2012T1R0M is rated for operation up to 125°C, making it suitable for high-temperature applications. However, the capacitance and ESR may vary with temperature.
  • Yes, the MBKK2012T1R0M is compatible with lead-free soldering processes, including SAC305 and Sn96.5Ag3Cu0.5.
  • The MBKK2012T1R0M has an MSL rating of 3, which means it can withstand exposure to moisture for up to 168 hours without requiring baking or drying.
  • Yes, the MBKK2012T1R0M is designed to withstand vibrations up to 10G, making it suitable for use in applications with high vibration levels.

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MBKK2012T1R0M Overview

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