The recommended PCB footprint for the MBR1060HEWS_R1_00001 is a standard SOD-123 package with a minimum pad size of 1.5mm x 1.5mm and a maximum pad size of 2.5mm x 2.5mm, with a 0.5mm spacing between pads.
To ensure reliable soldering, use a soldering iron with a temperature range of 250°C to 260°C, and apply a solder flux with a moderate activity level. The soldering time should be limited to 3-5 seconds, and the component should be handled by the edges to prevent damage.
The maximum allowable voltage stress on the MBR1060HEWS_R1_00001 during assembly is 50V, and it's recommended to use an ESD protection device to prevent damage from electrostatic discharge.
The MBR1060HEWS_R1_00001 is rated for operation up to 150°C, but it's recommended to derate the power handling capability by 20% for every 10°C above 125°C to ensure reliable operation.
The power dissipation of the MBR1060HEWS_R1_00001 can be calculated using the formula: Pd = (Vf x If) + (Vr x Ir), where Vf is the forward voltage drop, If is the forward current, Vr is the reverse voltage, and Ir is the reverse current. The calculated power dissipation should be within the recommended maximum power rating of 1W.
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MBR1060HEWS_R1_00001 Overview
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