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MBR30170MFST1G - onsemi

Description: Lower forward voltage; Lower leakage current in high temperature; Small junction capacitance; High avalanche energy capability; Alternative solution on SMC and DPAK package

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MBR30170MFST1G - onsemi  - 3D model
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MBR30170MFST1G Details

  • Manufacturer Part Number:

    MBR30170MFST1G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SO-8FL / DFN-5

  • Package Description:

    SO-8FL, DFN5, 6 PIN

  • Manufacturer Package Code:

    488AA

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Factory Lead Time:

    8 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    6.38

  • Additional Feature:

    FREE WHEELING DIODE

  • Application:

    GENERAL PURPOSE

  • Breakdown Voltage-Min:

    170 V

  • Case Connection:

    CATHODE

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    0.89 V

  • JESD-30 Code:

    R-PSSO-N4

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    540 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    4

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    30 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Rep Pk Reverse Voltage-Max:

    170 V

  • Reverse Current-Max:

    50 µA

  • Reverse Test Voltage:

    170 V

  • Surface Mount:

    YES

  • Technology:

    SCHOTTKY

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    NO LEAD

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    30

MBR30170MFST1G Frequently Asked Questions (FAQs)

  • A recommended PCB layout for optimal thermal performance would be to have a solid copper plane on the bottom layer of the PCB, connected to the thermal pad of the MBR30170MFST1G. This helps to dissipate heat efficiently. Additionally, it's recommended to have vias under the device to connect the thermal pad to the copper plane.
  • To ensure reliable operation at high temperatures, it's essential to follow the recommended operating conditions and derating guidelines provided in the datasheet. Additionally, consider using a heat sink or thermal interface material to reduce the junction temperature. It's also crucial to ensure good airflow and avoid thermal hotspots on the PCB.
  • The MBR30170MFST1G has built-in ESD protection, but it's still recommended to follow standard ESD handling procedures during assembly and testing. This includes using ESD-safe materials, wrist straps, and mats. Additionally, consider adding external ESD protection devices, such as TVS diodes, to protect the device from external ESD events.
  • Yes, the MBR30170MFST1G is suitable for high-reliability and automotive applications. However, it's essential to follow the recommended operating conditions, and ensure that the device is properly qualified and validated for the specific application. Additionally, consider using a device with a higher temperature rating, such as the MBR30170MFST1G-TL, which is specifically designed for automotive applications.
  • To troubleshoot issues with the MBR30170MFST1G, start by reviewing the datasheet and application notes to ensure that the device is being used within its recommended operating conditions. Check for proper PCB layout, thermal management, and ESD protection. Use oscilloscopes and other diagnostic tools to identify any issues with the device's input/output signals. If the issue persists, consider consulting with onsemi's technical support team or a qualified engineer.

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MBR30170MFST1G Overview

Use the download button to access the MBR30170MFST1G 3D model. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
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