- Datasheet Download Datasheet
- Stock & Prices $ Price & Stock for MBR30300CTH-BP
- Part Number MBR30300CTH-BP
- Manufacturer MCC
- Pin Count 3
- Part Category Transistor
- Package Category Transistor Outline, Vertical
- Footprint Name Transistor Outline, Vertical - MBR30300CTH-BP
- Released Date Jan 1, 2024
- Last Modified Date Mar 13, 2024 1:00 PM UTC
- Pinout / Pin List Click Here (Member Only)
MBR30300CTH-BP Details
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Manufacturer Part Number:
MBR30300CTH-BP
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Rohs Code:
Yes
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Part Life Cycle Code:
Active
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Country Of Origin:
Mainland China
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ECCN Code:
EAR99
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HTS Code:
8541.10.00.80
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Manufacturer:
Micro Commercial Components
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YTEOL:
5.87
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Additional Feature:
LOW LEAKAGE CURRENT
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Application:
GENERAL PURPOSE
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Breakdown Voltage-Min:
300 V
MBR30300CTH-BP Frequently Asked Questions (FAQs)
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The recommended PCB footprint for the MBR30300CTH-BP is a standard SOT-23 package with a 1.3mm x 1.3mm pad size and a 0.5mm x 0.5mm thermal pad.
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To ensure reliable operation of the MBR30300CTH-BP in high-temperature environments, it is recommended to follow proper thermal management practices, such as providing adequate heat sinking and airflow, and derating the device's power dissipation according to the datasheet's thermal derating curve.
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The maximum allowable voltage stress on the MBR30300CTH-BP's input pins is 5V, and it is recommended to use input voltage limiting resistors or clamping diodes to prevent voltage spikes or transients from exceeding this limit.
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Yes, the MBR30300CTH-BP can be used in switching power supplies, but it is recommended to follow proper design practices, such as using a suitable snubber network and ensuring that the device is operated within its safe operating area (SOA).
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The MBR30300CTH-BP's power dissipation can be determined by calculating the device's voltage drop and current, and then using the datasheet's thermal resistance values to estimate the junction temperature. It is recommended to use thermal simulation tools or to perform thermal measurements to ensure accurate results.
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MBR30300CTH-BP Overview
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