GeneSic recommends a 2-layer PCB with a thermal pad on the bottom side, and a heat sink with a thermal interface material (TIM) for efficient heat dissipation. A minimum of 2 oz copper thickness is recommended for the PCB.
Follow the recommended operating conditions, ensure proper PCB layout and routing, use a suitable heat sink, and implement overvoltage protection (OVP) and overcurrent protection (OCP) circuits. Additionally, use a TVS diode for electrostatic discharge (ESD) protection.
A gate driver with a high current capability (e.g., 2A) and a low output impedance is recommended. A bootstrap circuit can be used to generate the gate drive voltage. Ensure the gate drive circuit is properly decoupled and filtered to minimize noise and ringing.
Use a low-inductance PCB layout, minimize the gate drive loop inductance, and ensure proper decoupling of the power supply. A high-frequency capable gate driver and a low-ESR output capacitor are also recommended. Additionally, consider using a snubber circuit to reduce ringing and overshoot.
Use a curve tracer or a high-power semiconductor parameter analyzer to characterize the device. For dynamic characterization, use a double-pulse tester or a high-frequency switching test setup. Ensure proper probing and measurement techniques to minimize measurement errors.
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MBR35100 Overview
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