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MBR60100PT - Taiwan Semiconductor

Description: Taiwan Semi MBR60100PT, Dual Schottky Diode, Common Cathode, 100V 60A, 3-Pin TO-3P

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Symbol
MBR60100PT - Taiwan Semiconductor - PCB symbol
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PCB Footprints
MBR60100PT - Taiwan Semiconductor PCB footprint - Transistor Outline, Vertical - Transistor Outline, Vertical - TO-3P/TO-247AD
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3D Models
MBR60100PT - Taiwan Semiconductor - 3D model - Transistor Outline, Vertical - TO-3P/TO-247AD
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MBR60100PT Details

  • Manufacturer Part Number:

    MBR60100PT

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Factory Lead Time:

    8 Weeks

  • Manufacturer:

    Taiwan Semiconductor

  • YTEOL:

    5.82

  • Additional Feature:

    FREE WHEELING DIODE, LOW POWER LOSS

  • Application:

    EFFICIENCY

  • Case Connection:

    CATHODE

  • Configuration:

    COMMON CATHODE, 2 ELEMENTS

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    0.62 V

  • JEDEC-95 Code:

    TO-247AD

  • JESD-30 Code:

    R-PSFM-T3

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    420 A

  • Number of Elements:

    2

  • Number of Phases:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -65 °C

  • Output Current-Max:

    30 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Reference Standard:

    UL RECOGNIZED

  • Rep Pk Reverse Voltage-Max:

    100 V

  • Surface Mount:

    NO

  • Technology:

    SCHOTTKY

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

MBR60100PT Frequently Asked Questions (FAQs)

  • A thermal pad on the bottom of the package should be connected to a large copper area on the PCB to dissipate heat. Multiple vias can be used to connect the thermal pad to an inner layer or the backside of the PCB for better heat dissipation.
  • Ensure that the device is operated within the recommended voltage and current ratings, and that the PCB is designed to minimize thermal resistance. Additionally, consider using a thermal interface material (TIM) to improve heat transfer between the device and the heat sink.
  • Use a multi-layer PCB with a solid ground plane, and ensure that high-frequency signals are routed away from the device. Use shielding or a metal can to enclose the device, and consider using EMI filters or ferrite beads to reduce emissions.
  • Use a robust power delivery system with a low-ESR capacitor and a high-current rating. Ensure that the PCB traces and vias are designed to handle the high current, and consider using a power plane or a dedicated power layer to reduce resistance.
  • The MBR60100PT is designed to meet the reliability standards of the automotive industry, with a typical lifespan of 10-15 years. However, the actual lifespan will depend on factors such as operating conditions, temperature, and quality of the PCB and components.

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MBR60100PT Overview

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MBR60100PT Alternates

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Part Image MBR60100PTC0 Taiwan Semiconductor

Rectifier Diode, Schottky, 1 Phase, 2 Element, 30A, 100V V(RRM), Silicon, TO-247AD