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MBRA1H100T3G - onsemi

Description: Small Compact Surface Mountable Package with J-Bent Leads; Rectangular Package for Automated Handling; Highly Stable Oxide Passivated Junction; Low Forward Voltage Drop; Guardring for Stress Protection; This is a Pb-Free Device Mechanical Characteristics:; Case: Epoxy, Molded; Weight: 70 mg (approximately); Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable; Lead and Mounting Surface Temperature for Soldering Purposes: 260°C Max. for 10 Seconds; Shipped in 12mm Tape,

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MBRA1H100T3G - onsemi PCB footprint - Diodes Moulded - Diodes Moulded - SMA CASE 403D ISSUE H_1
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MBRA1H100T3G - onsemi  - 3D model - Diodes Moulded - SMA CASE 403D ISSUE H_1
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MBRA1H100T3G Details

  • Manufacturer Part Number:

    MBRA1H100T3G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SMA

  • Pin Count:

    2

  • Manufacturer Package Code:

    403D-02

  • Country Of Origin:

    Mainland China, Vietnam

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Factory Lead Time:

    9 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    6

  • Additional Feature:

    FREE WHEELING DIODE

  • Application:

    POWER

  • Breakdown Voltage-Min:

    100 V

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    0.84 V

  • JESD-30 Code:

    R-PDSO-C2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    50 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -65 °C

  • Output Current-Max:

    1 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Rep Pk Reverse Voltage-Max:

    100 V

  • Reverse Current-Max:

    40 µA

  • Reverse Test Voltage:

    100 V

  • Surface Mount:

    YES

  • Technology:

    SCHOTTKY

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    C BEND

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

MBRA1H100T3G Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the MBRA1H100T3G is a standard SOD-123 package footprint with a pad size of 1.5mm x 1.5mm and a thermal pad size of 2.5mm x 2.5mm.
  • To ensure proper soldering, use a soldering iron with a temperature of 250°C to 260°C, and apply a small amount of solder paste to the PCB pads. Use a soldering technique that minimizes the risk of overheating the component.
  • The MBRA1H100T3G has an operating temperature range of -55°C to 150°C, but the maximum operating temperature range for reliable operation is -40°C to 125°C.
  • Store the MBRA1H100T3G in its original packaging or in a dry, cool place away from direct sunlight. Avoid exposing the component to moisture, extreme temperatures, or physical stress during shipping and storage.
  • The MBRA1H100T3G has an ESD rating of Human Body Model (HBM) ≥ 2 kV and Charged Device Model (CDM) ≥ 500 V. Handle the component with ESD-protective equipment and follow proper ESD handling procedures to prevent damage.

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MBRA1H100T3G Overview

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