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NRVBA1H100T3G - onsemi

Description: Obsolete - Schottky Power Rectifier, Surface Mount, 2.0 A, 10 V

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NRVBA1H100T3G - onsemi - PCB symbol
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NRVBA1H100T3G - onsemi PCB footprint - Diodes Moulded - Diodes Moulded - NRVBA1H100T3G
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NRVBA1H100T3G - onsemi - 3D model - Diodes Moulded - NRVBA1H100T3G
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NRVBA1H100T3G Details

  • Manufacturer Part Number:

    NRVBA1H100T3G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SMA

  • Pin Count:

    2

  • Manufacturer Package Code:

    403D-02

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Additional Feature:

    FREE WHEELING DIODE

  • Application:

    POWER

  • Breakdown Voltage-Min:

    100 V

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    0.84 V

  • JESD-30 Code:

    R-PDSO-C2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    50 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -65 °C

  • Output Current-Max:

    1 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Reference Standard:

    AEC-Q101

  • Rep Pk Reverse Voltage-Max:

    100 V

  • Reverse Current-Max:

    40 µA

  • Reverse Test Voltage:

    100 V

  • Surface Mount:

    YES

  • Technology:

    SCHOTTKY

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    C BEND

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

NRVBA1H100T3G Frequently Asked Questions (FAQs)

  • A thermal pad on the bottom of the package should be connected to a large copper area on the PCB to dissipate heat. Multiple vias can be used to connect the thermal pad to an inner layer or the backside of the PCB for better heat dissipation.
  • The device requires a stable input voltage and a proper biasing circuit to ensure optimal performance. A voltage regulator or a voltage reference can be used to provide a stable input voltage. The biasing circuit should be designed to provide a stable voltage and current to the device.
  • The device is sensitive to electrostatic discharge (ESD) and can be damaged by static electricity. Handling the device with an ESD wrist strap or mat, and storing it in an ESD-safe environment can prevent damage. Additionally, the device should be handled by the body and not the leads to prevent mechanical stress.
  • The optimal operating frequency depends on the specific application and the required performance. The device datasheet provides a recommended operating frequency range, but the optimal frequency may vary depending on the specific use case. Simulation tools and testing can be used to determine the optimal operating frequency.
  • The NRVBA1H100T3G meets various reliability and quality standards, including AEC-Q101, which is a standard for automotive-grade semiconductor devices. The device also meets the requirements of the ISO/TS 16949 quality management system.

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NRVBA1H100T3G Overview

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