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MBRA2H100T3G - onsemi

Description: Compact Package with J-Bend Leads Ideal for Automated Handling; Highly Stable Oxide Passivated Junction; Guard-Ring for Overvoltage Protection; Low Forward Voltage Drop; This is a Pb-Free Device Mechanical Characteristics:; Case: Molded Epoxy; Epoxy Meets UL 94 V-0 @ 0.125 in; Weight: 70 mg (approximately); Cathode Polarity Band; Lead and Mounting Surface Temperature for Soldering Purposes: 260C Max. for 10 Seconds; Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable;

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PCB Footprints
MBRA2H100T3G - onsemi PCB footprint - Diodes Moulded - Diodes Moulded - SMA CASE 403D ISSUE H
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MBRA2H100T3G - onsemi  - 3D model - Diodes Moulded - SMA CASE 403D ISSUE H
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MBRA2H100T3G Details

  • Manufacturer Part Number:

    MBRA2H100T3G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SMA

  • Pin Count:

    2

  • Manufacturer Package Code:

    403D-02

  • Country Of Origin:

    Mainland China, Vietnam

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Factory Lead Time:

    9 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    6

  • Additional Feature:

    FREE WHEELING DIODE

  • Application:

    POWER

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    0.79 V

  • JESD-30 Code:

    R-PDSO-C2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    130 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -65 °C

  • Output Current-Max:

    2 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Rep Pk Reverse Voltage-Max:

    100 V

  • Reverse Current-Max:

    8 µA

  • Reverse Test Voltage:

    100 V

  • Surface Mount:

    YES

  • Technology:

    SCHOTTKY

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    C BEND

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

MBRA2H100T3G Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the MBRA2H100T3G is a pad size of 1.3 mm x 0.8 mm with a 0.5 mm spacing between pads. It's essential to follow the recommended footprint to ensure proper thermal performance and to prevent overheating.
  • To ensure proper soldering, use a soldering iron with a temperature of 250°C to 260°C. Apply a small amount of solder paste to the PCB pads, and then place the MBRA2H100T3G on the pads. Use a reflow oven or a hot air gun to melt the solder paste, and ensure the component is properly aligned during the soldering process.
  • The MBRA2H100T3G has an operating temperature range of -55°C to 150°C. However, it's recommended to operate the device within a temperature range of -40°C to 125°C for optimal performance and reliability.
  • To prevent damage, store the MBRA2H100T3G in its original packaging or in a dry, ESD-protected environment. Avoid exposing the device to moisture, extreme temperatures, or physical stress during shipping and storage.
  • The MBRA2H100T3G is an ESD-sensitive device and requires proper handling and storage to prevent damage. Use ESD-protected workstations, wrist straps, and packaging materials to prevent electrostatic discharge.

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MBRA2H100T3G Overview

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