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MBRAF440T3G - onsemi

Description: Low Profile Package for Space Constrained Applications; Rectangular Package for Automated Handling; Highly Stable Oxide Passivated Junction; 150°C Operating Junction Temperature; Guard-Ring for Stress Protection; These are Pb-Free and Halide-Free Devices Mechanical Characteristics:; Case: Epoxy, Molded, Epoxy Meets UL 94, V-0; Weight: 95 mg (approximately); Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable; Lead and Mounting Surface Temperature for Soldering Purpose

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Symbol
MBRAF440T3G - onsemi - PCB symbol
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PCB Footprints
MBRAF440T3G - onsemi PCB footprint - Small Outline Diode Flat Lead - Small Outline Diode Flat Lead - MBRAF440T3G
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3D Models
MBRAF440T3G - onsemi - 3D model - Small Outline Diode Flat Lead - MBRAF440T3G
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MBRAF440T3G Details

  • Manufacturer Part Number:

    MBRAF440T3G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SMA-FL

  • Package Description:

    SMA-FL, 2 PIN

  • Pin Count:

    2

  • Manufacturer Package Code:

    403AA

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Factory Lead Time:

    10 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    6.12

  • Additional Feature:

    FREE WHEELING DIODE

  • Application:

    POWER

  • Breakdown Voltage-Min:

    40 V

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    0.485 V

  • JESD-30 Code:

    R-PDSO-F2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    100 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    4 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Rep Pk Reverse Voltage-Max:

    40 V

  • Reverse Current-Max:

    300 µA

  • Reverse Test Voltage:

    40 V

  • Surface Mount:

    YES

  • Technology:

    SCHOTTKY

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

MBRAF440T3G Frequently Asked Questions (FAQs)

  • A thermal pad on the bottom of the package should be connected to a large copper area on the PCB to dissipate heat. A minimum of 2 oz copper thickness is recommended. Additionally, vias should be placed under the package to connect the thermal pad to the copper area.
  • Ensure that the device is operated within the recommended junction temperature range (TJ) of -55°C to 150°C. Also, consider the power dissipation and thermal resistance of the package when designing the system. A heat sink or thermal interface material may be necessary for high-power applications.
  • The recommended soldering profile is a peak temperature of 260°C for 10-30 seconds, with a ramp-up rate of 3°C/s and a ramp-down rate of 6°C/s. This ensures that the device is not damaged during the soldering process.
  • The MBRAF440T3G has built-in ESD protection, but it's still important to follow proper ESD handling procedures during assembly and testing. Use an ESD wrist strap or mat, and ensure that all equipment is properly grounded.
  • Store the devices in their original packaging or in a dry, dark place at a temperature range of -40°C to 30°C and humidity below 60%. Avoid exposing the devices to direct sunlight, moisture, or extreme temperatures.

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MBRAF440T3G Overview

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