Description:Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable; Case: Epoxy, Molded; Lead and Mounting Surface Temperature for Soldering Purposes: 260 °C Max. for 10 Seconds; Available in 16 mm Tape and Reel, 2500 units per reel, by adding a "T4'' suffix to the part number; Extremely Low Forward Drop; Platinum Barrier with Avalanche Guardrings Mechanical Characteristics:; Weight: 0.4 gram (approximately); Marking: B320, B330, B340, B350, B360; Extremely Fast Switching; Shipped 7
A thermal pad is recommended under the package to improve heat dissipation. A minimum of 2 oz copper thickness and a thermal relief pattern are suggested. Refer to the onsemi application note AND9173/D for more details.
Ensure proper heat sinking, use a thermally conductive interface material, and follow the recommended PCB layout. Also, consider derating the device's power handling capability at high temperatures (above 125°C).
The device has built-in ESD protection, but handling precautions are still necessary. Use an ESD wrist strap or mat, and handle the device by the body or pins, avoiding direct contact with the die.
Yes, the MBRD360G is qualified for automotive and high-reliability applications. It meets the AEC-Q101 qualification standard and is PPAP capable. However, additional testing and validation may be required for specific applications.
Follow the onsemi recommended soldering profile: peak temperature 260°C, time above 217°C 60-90 seconds, and a maximum of 3 reflows. For rework, use a low-temperature soldering iron and a thermal protection device to prevent overheating.
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MBRD360G Overview
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