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MBRD5200-TP - MCC

Description: Diode 200 V 5A Surface Mount DPAK

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MBRD5200-TP - MCC PCB footprint - Other - Other - MBRD5200-TP
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MBRD5200-TP - MCC  - 3D model - Other - MBRD5200-TP
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MBRD5200-TP Details

  • Manufacturer Part Number:

    MBRD5200-TP

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Manufacturer:

    Micro Commercial Components

  • YTEOL:

    6.45

  • Additional Feature:

    HIGH RELIABILITY

  • Application:

    GENERAL PURPOSE

  • Case Connection:

    CATHODE

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    0.86 V

  • JEDEC-95 Code:

    TO-252

  • JESD-30 Code:

    R-PSSO-G2

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    130 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    5 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Rep Pk Reverse Voltage-Max:

    200 V

  • Reverse Current-Max:

    5 µA

  • Surface Mount:

    YES

  • Technology:

    SCHOTTKY

  • Terminal Form:

    GULL WING

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    10

MBRD5200-TP Frequently Asked Questions (FAQs)

  • The recommended PCB layout involves placing the device on a 2-layer or 4-layer board with a solid ground plane, and using thermal vias to dissipate heat. A heat sink or thermal pad can also be used to improve thermal management.
  • To ensure reliable operation in high-temperature environments, it's essential to follow the recommended operating temperature range (up to 150°C), use a heat sink or thermal pad, and ensure good airflow around the device.
  • The MBRD5200-TP has built-in ESD protection, but it's still important to follow standard ESD handling precautions, such as using an ESD wrist strap, mat, or workstation, and storing the devices in anti-static packaging.
  • While the MBRD5200-TP is a high-quality device, it's essential to consult with Micro Commercial Components or a qualified representative to determine its suitability for high-reliability or aerospace applications, as additional testing and certification may be required.
  • The recommended soldering technique is reflow soldering, and the device should be assembled using a no-clean or water-soluble flux. It's also important to follow the recommended soldering temperature profile and handling procedures.

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MBRD5200-TP Overview

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