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MBRF30L45CTG - onsemi

Description: Low Forward Voltage; Low Power Loss/High Efficiency; High Surge Capacity; 150C Operating Junction Temperature; 30 A Total (15 A Per Diode Leg); Guard-Ring for Stress Protection Mechanical Characteristics :; Case: Epoxy, Molded; Epoxy Meets UL 94 V-0 @ 0.125 in; Weight (Approximately): 1.9 Grams; Finish: All External Surfaces Corrosion Resistant and TerminalLeads are Readily Solderable; Lead Temperature for Soldering Purposes:260C Max. for 10 Seconds; Shipped 50 Units Per Plastic Tube; This is a Pb-Free Devi

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MBR3050FCT-H Formosa Microsemi Co Ltd