GeneSic recommends a 2-layer PCB with a thermal pad connected to a large copper area on the bottom layer for heat dissipation. A minimum of 1 oz copper thickness is recommended. Additionally, a thermal interface material (TIM) with a thermal conductivity of at least 1 W/m-K should be used between the device and the heat sink.
To prevent overheating, ensure that the device is operated within the recommended temperature range (TJ ≤ 150°C). Implement a thermal monitoring system to detect overheating and take corrective action. Also, ensure proper heat sinking, and consider using a heat sink with a thermal resistance of ≤ 1°C/W.
GeneSic recommends using a soldering temperature of 260°C (max) and a soldering time of 3 seconds (max) to prevent damage to the device. Use a solder with a melting point of 217°C (min) and ensure that the PCB is designed with a solder mask to prevent solder bridging.
Handle the device with ESD-protective equipment and follow proper ESD handling procedures. Ensure that the PCB is designed with ESD protection components, such as TVS diodes or ESD protection arrays, to prevent damage during assembly and operation.
GeneSic recommends performing electrical characterization tests, such as I-V curve tracing and switching time measurements, to validate the device's performance. Additionally, perform environmental tests, such as temperature cycling and humidity testing, to ensure the device's reliability and robustness.
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MBRH20045R Overview
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