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- Part Number MBRL30300CT-BP
- Manufacturer MCC
- Pin Count 3
- Part Category Schottky Diode
- Package Category Transistor Outline, Vertical
- Footprint Name Transistor Outline, Vertical - TO-220AB_2024
- Released Date Jan 21, 2025
- Last Modified Date Jan 21, 2025 3:41 AM UTC
- Pinout / Pin List Click Here (Member Only)
MBRL30300CT-BP Details
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Manufacturer Part Number:
MBRL30300CT-BP
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Rohs Code:
Yes
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Part Life Cycle Code:
Active
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Country Of Origin:
Mainland China
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ECCN Code:
EAR99
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HTS Code:
8541.10.00.80
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Manufacturer:
Micro Commercial Components
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YTEOL:
5.87
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Additional Feature:
LOW LEAKAGE CURRENT
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Application:
GENERAL PURPOSE
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Case Connection:
CATHODE
MBRL30300CT-BP Frequently Asked Questions (FAQs)
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The recommended land pattern for the MBRL30300CT-BP is a rectangular pad with a size of 1.3mm x 0.8mm, with a non-solder mask defined (NSMD) pad shape. The pad should be centered on the component and have a solder mask clearance of 0.1mm.
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The thermal pad on the MBRL30300CT-BP should be connected to a solid ground plane on the PCB to ensure good thermal dissipation. A thermal via or a thermal pad with a thermal relief pattern can be used to connect the thermal pad to the ground plane.
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The maximum operating temperature range for the MBRL30300CT-BP is -40°C to +125°C. However, the device can be operated up to +150°C for a short period of time (less than 100 hours) without affecting its reliability.
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To ensure proper soldering of the MBRL30300CT-BP, use a soldering iron with a temperature of 250°C to 260°C, and apply a small amount of solder paste to the pads. Use a soldering technique that minimizes the risk of overheating the component, such as using a hot air soldering technique.
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The recommended storage condition for the MBRL30300CT-BP is in a dry, cool place with a temperature range of 5°C to 30°C and a relative humidity of 60% or less. The components should be stored in their original packaging or in a similar environment to prevent moisture absorption.
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MBRL30300CT-BP Overview
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