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MBRM140T1G - onsemi

Description: Low Profile - Maximum Height of 1.1 mm; Small Footprint - Footprint Area of 8.45 mm2; Low VF Provides Higher Efficiency and Extends Battery Life; Supplied in 12 mm Tape and Reel; Low Thermal Resistance with Direct Thermal Path of Die on Exposed Cathode Heat Sink Mechanical Characteristics:; Powermite is JEDEC Registered as DO-216AA; Case: Molded Epoxy; Epoxy Meets UL94V-0 at 1/8"; Weight: 62 mg (approximately); Device Marking: BCJ; Lead and Mounting Surface Temperature for Soldering Purposes. 260°C Maximum

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Symbol
MBRM140T1G - onsemi - PCB symbol
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PCB Footprints
MBRM140T1G - onsemi PCB footprint - Other - Other - POWERMITE CASE 457 ISSUE G
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3D Models
MBRM140T1G - onsemi - 3D model - Other - POWERMITE CASE 457 ISSUE G
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MBRM140T1G Details

  • Manufacturer Part Number:

    MBRM140T1G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    POWERMITE

  • Package Description:

    POWERMITE-2

  • Pin Count:

    2

  • Manufacturer Package Code:

    457-04

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Manufacturer:

    onsemi

  • YTEOL:

    6.1

  • Application:

    GENERAL PURPOSE

  • Breakdown Voltage-Min:

    40 V

  • Case Connection:

    CATHODE

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    0.3 V

  • JEDEC-95 Code:

    DO-216AA

  • JESD-30 Code:

    R-PSSO-G1

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    50 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    1

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    1 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Rep Pk Reverse Voltage-Max:

    40 V

  • Reverse Current-Max:

    500 µA

  • Reverse Test Voltage:

    40 V

  • Surface Mount:

    YES

  • Technology:

    SCHOTTKY

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    GULL WING

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    30

MBRM140T1G Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the MBRM140T1G is -55°C to 150°C.
  • To ensure reliability, follow the recommended assembly and soldering procedures, and ensure that the device is operated within the specified voltage and current ratings. Additionally, consider using a thermal management strategy to keep the device within its recommended operating temperature range.
  • The recommended PCB layout for the MBRM140T1G involves using a thermal pad and thermal vias to dissipate heat. A heat sink or thermal interface material can also be used to improve thermal performance. Consult the onsemi application note for more detailed guidance.
  • The MBRM140T1G has built-in ESD protection, but it is still important to follow proper ESD handling procedures during assembly and testing. Use an ESD wrist strap or mat, and ensure that all equipment and tools are properly grounded.
  • Store the MBRM140T1G in a dry, cool place, away from direct sunlight and moisture. Handle the device by the body, avoiding touching the leads or die. Use anti-static packaging and follow proper ESD handling procedures.

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MBRM140T1G Overview

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