MBRM1H100T3G footprint, schematic symbol and 3D model by onsemi

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PCB Footprints

MBRM1H100T3G - onsemi PCB footprint - Other - Other - MBRM1H100T3G-2

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Part Number MBRM1H100T3G
Manufacturer onsemi
Pin Count 2
Part Category Schottky Diode
Package Category Other
Footprint Name Other - MBRM1H100T3G-2
Released Date Mar 13, 2018
Last Modified Date Jan 22, 2025 4:53 PM UTC
Pinout / Pin List Click Here (Member Only)

MBRM1H100T3G Details

Manufacturer Part Number:
MBRM1H100T3G
Brand Name:
onsemi
Pbfree Code:
Yes
Rohs Code:
Yes
Part Life Cycle Code:
Active
Part Package Code:
POWERMITE
Pin Count:
2
Manufacturer Package Code:
457-04
Country Of Origin:
Malaysia
ECCN Code:
EAR99
HTS Code:
8541.10.00.80
Factory Lead Time:
8 Weeks
Manufacturer:
onsemi
YTEOL:
6.07
Application:
EFFICIENCY
Breakdown Voltage-Min:
100 V
Case Connection:
CATHODE
Configuration:
SINGLE
Diode Element Material:
SILICON
Diode Type:
RECTIFIER DIODE
Forward Voltage-Max (VF):
0.84 V
JEDEC-95 Code:
DO-216AA
JESD-30 Code:
R-PSSO-G1
JESD-609 Code:
e3
Moisture Sensitivity Level:
1
Non-rep Pk Forward Current-Max:
50 A
Number of Elements:
1
Number of Phases:
1
Number of Terminals:
1
Operating Temperature-Max:
175 °C
Operating Temperature-Min:
-65 °C
Output Current-Max:
1 A
Package Body Material:
PLASTIC/EPOXY
Package Shape:
RECTANGULAR
Package Style:
SMALL OUTLINE
Peak Reflow Temperature (Cel):
260
Qualification Status:
Not Qualified
Rep Pk Reverse Voltage-Max:
100 V
Reverse Current-Max:
20 µA
Reverse Test Voltage:
100 V
Surface Mount:
YES
Technology:
SCHOTTKY
Terminal Finish:
Matte Tin (Sn) - annealed
Terminal Form:
GULL WING
Terminal Position:
SINGLE
Time@Peak Reflow Temperature-Max (s):
30

MBRM1H100T3G Frequently Asked Questions (FAQs)

The maximum operating temperature range for the MBRM1H100T3G is -55°C to 150°C.
To ensure reliability, follow the recommended storage and handling procedures, and ensure that the device is operated within the specified voltage and current ratings. Additionally, consider using a robust PCB design, proper thermal management, and adequate decoupling capacitors.
The recommended land pattern for the MBRM1H100T3G is a rectangular pad with a size of 1.3 mm x 0.8 mm, with a 0.3 mm x 0.3 mm thermal pad in the center. The land pattern should be designed to accommodate the device's thermal characteristics and ensure good thermal conductivity.
Yes, the MBRM1H100T3G is suitable for high-frequency switching applications up to 100 kHz. However, ensure that the device is operated within the specified voltage and current ratings, and that the PCB design and layout are optimized for high-frequency operation.
Handle the MBRM1H100T3G by the body, avoiding touching the leads or die. Use an anti-static wrist strap or mat to prevent electrostatic discharge damage. During rework, use a low-temperature soldering iron and avoid applying excessive heat or force to the device.

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MBRM1H100T3G Overview

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