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MBRS4201T3G - onsemi

Description: Lower Forward Voltage than any Ultrafast Rectifier: VF < 0.61 V at 150C; Fast Switching Speed: Reverse Recovery Time (tRR) < 35 ns; Soft Recovery Characteristics: Softness Factor (tb/ta) < 1; Highly Stable Over Temperature; Pb-Free Package is Available; AEC-Q101 Qualified and PPAP Capable; NRVB Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements

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PCB Footprints
MBRS4201T3G - onsemi PCB footprint - Diodes Moulded - Diodes Moulded - SMC CASE403-03
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3D Models
MBRS4201T3G - onsemi  - 3D model - Diodes Moulded - SMC CASE403-03
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MBRS4201T3G Details

  • Manufacturer Part Number:

    MBRS4201T3G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SMC

  • Package Description:

    SMC, 2 PIN

  • Pin Count:

    2

  • Manufacturer Package Code:

    403AC

  • Country Of Origin:

    Mainland China, Vietnam

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Factory Lead Time:

    10 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    6

  • Application:

    ULTRA FAST SOFT RECOVERY POWER

  • Breakdown Voltage-Min:

    200 V

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    0.86 V

  • JESD-30 Code:

    R-PDSO-C2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    100 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    4 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Rep Pk Reverse Voltage-Max:

    200 V

  • Reverse Current-Max:

    1000 µA

  • Reverse Recovery Time-Max:

    0.035 µs

  • Reverse Test Voltage:

    200 V

  • Surface Mount:

    YES

  • Technology:

    SCHOTTKY

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    C BEND

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

MBRS4201T3G Frequently Asked Questions (FAQs)

  • A thermal pad on the bottom of the package should be connected to a large copper area on the PCB to dissipate heat. A minimum of 2 oz copper thickness is recommended. Additionally, vias should be placed under the package to connect the thermal pad to the copper area.
  • Ensure that the device is operated within the recommended junction temperature range (TJ) of -55°C to 150°C. Also, consider the power dissipation and thermal resistance of the package when designing the system.
  • A soldering profile with a peak temperature of 260°C and a dwell time of 10-30 seconds is recommended. The device should be soldered using a reflow soldering process with a nitrogen atmosphere to prevent oxidation.
  • Handle the device in an ESD-protected environment, and use ESD-protective packaging and handling materials. Ground yourself before handling the device, and use an ESD wrist strap or mat.
  • Store the device in a dry, cool place, away from direct sunlight and moisture. The storage temperature should be between -40°C to 30°C, and the relative humidity should be below 60%.

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MBRS4201T3G Overview

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