The recommended land pattern for the MBRX120LF-TP is a rectangular pad with a size of 1.5mm x 2.5mm, with a 0.5mm radius corner and a 0.2mm solder mask clearance.
The MBRX120LF-TP has a thermal resistance of 25°C/W. To handle thermal considerations, ensure good thermal conduction by using a thermal pad or a heat sink, and keep the ambient temperature below 125°C.
The maximum allowable voltage for the MBRX120LF-TP is 120V, with a maximum repetitive peak voltage of 150V.
To ensure reliability, follow the recommended derating curve, and ensure the device operates within the specified temperature range of -55°C to 150°C. Also, consider using a heat sink or thermal pad to dissipate heat.
The recommended soldering profile for the MBRX120LF-TP is a peak temperature of 260°C, with a dwell time of 10-30 seconds, and a preheat temperature of 150-180°C.
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MBRX120LF-TP Overview
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