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MBT3904DW1T3G - onsemi

Description: Simplifies Circuit Design; Reduces Component Count; Available in 8 mm, 7-inch/3,000 Unit Tape and Reel; hFE, 100-300; Reduces Board Space; S and NSV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC-Q101 Qualified and PPAP Capable; These Devices are Pb-Free, Halogen Free/BFR Free and are RoHS CompliantCapable

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MBT3904DW1T3G - onsemi - PCB symbol
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PCB Footprints
MBT3904DW1T3G - onsemi PCB footprint - SOT23 (6-Pin) - SOT23 (6-Pin) - SC-88(SOT-363) CASE 419B-02 ISSUE Y
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3D Models
MBT3904DW1T3G - onsemi - 3D model - SOT23 (6-Pin) - SC-88(SOT-363) CASE 419B-02 ISSUE Y
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MBT3904DW1T3G Details

  • Manufacturer Part Number:

    MBT3904DW1T3G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SC-88/SC70-6/SOT-363 6 LEAD

  • Package Description:

    SC-88, 6 PIN

  • Pin Count:

    6

  • Manufacturer Package Code:

    419B-02

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • Manufacturer:

    onsemi

  • YTEOL:

    7

  • Collector Current-Max (IC):

    0.2 A

  • Collector-Emitter Voltage-Max:

    40 V

  • Configuration:

    SEPARATE, 2 ELEMENTS

  • DC Current Gain-Min (hFE):

    30

  • JESD-30 Code:

    R-PDSO-G6

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    2

  • Number of Terminals:

    6

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    NPN

  • Power Dissipation-Max (Abs):

    0.15 W

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    AMPLIFIER

  • Transistor Element Material:

    SILICON

  • Transition Frequency-Nom (fT):

    300 MHz

  • Turn-off Time-Max (toff):

    250 ns

  • Turn-on Time-Max (ton):

    70 ns

MBT3904DW1T3G Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. The device should be placed near a thermal pad or a heat sink to dissipate heat efficiently.
  • Ensure that the device is operated within the recommended temperature range (−40°C to +150°C). Use a heat sink or thermal pad to maintain a safe junction temperature (Tj) below 150°C. Monitor the device's thermal resistance (RθJA) and adjust the PCB design accordingly.
  • The device has built-in ESD protection, but it's still recommended to follow standard ESD handling procedures during assembly and testing. Use an ESD wrist strap or mat, and ensure that the device is handled in a static-safe environment.
  • Yes, the MBT3904DW1T3G is AEC-Q101 qualified, making it suitable for automotive and high-reliability applications. However, ensure that the device is used within the recommended operating conditions and that the PCB design meets the required reliability standards.
  • Use a logic analyzer or oscilloscope to monitor the device's input and output signals. Check the power supply voltage, input signal integrity, and output load conditions. Consult the datasheet and application notes for troubleshooting guidelines and common failure modes.

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MBT3904DW1T3G Overview

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