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MC0063W06031110K - Multicomp Pro

Description: MULTICOMP - MC0063W06031110K - RES, THICK FILM, 110K, 1%, 0.063W, 0603

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PCB Footprints
MC0063W06031110K - Multicomp Pro PCB footprint - Resistor Chip - Resistor Chip - MC0063W0603
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3D Models
MC0063W06031110K - Multicomp Pro  - 3D model - Resistor Chip - MC0063W0603
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MC0063W06031110K Details

  • Manufacturer Part Number:

    MC0063W06031110K

  • Part Life Cycle Code:

    Active

  • Reach Compliance Code:

    Unknown

  • ECCN Code:

    EAR99

  • HTS Code:

    8533.21.00.30

  • Manufacturer:

    SPC Multicomp

  • YTEOL:

    13

  • Construction:

    Rectangular

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    155 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.45 mm

  • Package Length:

    1.6 mm

  • Package Style:

    SMT

  • Package Width:

    0.8 mm

  • Packing Method:

    TR

  • Rated Power Dissipation (P):

    0.063 W

  • Rated Temperature:

    70 °C

  • Resistance:

    110000 Ω

  • Resistor Type:

    FIXED RESISTOR

  • Size Code:

    0603

  • Surface Mount:

    YES

  • Technology:

    METAL GLAZE/THICK FILM

  • Temperature Coefficient:

    100 ppm/°C

  • Terminal Shape:

    WRAPAROUND

  • Tolerance:

    1%

  • Working Voltage:

    50 V

MC0063W06031110K Frequently Asked Questions (FAQs)

  • The recommended storage condition for MC0063W06031110K is in a dry, cool place with a temperature range of 10°C to 30°C and humidity below 70%. This helps prevent moisture absorption and ensures the component's reliability.
  • While the MC0063W06031110K is a robust component, it's not specifically designed for high-vibration applications. However, it can withstand moderate vibrations. If your application involves extreme vibrations, consider using a component with explicit vibration resistance or consult with the manufacturer for guidance.
  • To prevent damage during soldering, ensure the component is handled by the edges, avoiding touching the pins or the component body. Use a soldering iron with a temperature below 260°C, and limit the soldering time to 3 seconds per pin. Also, use a solder with a low melting point and a flux that is compatible with the component's materials.
  • The maximum allowable power dissipation for MC0063W06031110K is 1.5W. Exceeding this limit can cause the component to overheat, leading to reduced performance, reliability issues, or even failure.
  • Yes, MC0063W06031110K is compatible with lead-free soldering processes. The component's materials and construction are designed to withstand the higher temperatures associated with lead-free soldering.

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MC0063W06031110K Overview

Use the download button to access the MC0063W06031110K schematic symbol, PCB footprint, and 3D model.
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Part Image RC1608F114AS Samsung Electro-Mechanics

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Part Image 0603WGF1103B5E Royal Electronic Factory (Thailand) Co Ltd

Fixed Resistor, Metal Glaze/thick Film, 0.0625W, 110000ohm, 50V, 1% +/-Tol, 100ppm/Cel, Surface Mount, 0603

Part Image 0603SAF1103C1 Royal Electronic Factory (Thailand) Co Ltd

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