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MC0125W120615K6 - Multicomp Pro

Description: MULTICOMP - MC0125W120615K6 - RES, THICK FILM, 5K6, 1%, 0.125W, 1206

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MC0125W120615K6 - Multicomp Pro - PCB symbol
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PCB Footprints
MC0125W120615K6 - Multicomp Pro PCB footprint - Resistor Chip - Resistor Chip - MC0125W1206
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3D Models
MC0125W120615K6 - Multicomp Pro - 3D model - Resistor Chip - MC0125W1206
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MC0125W120615K6 Details

  • Manufacturer Part Number:

    MC0125W120615K6

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Unknown

  • ECCN Code:

    EAR99

  • HTS Code:

    8533.21.00.30

  • Manufacturer:

    SPC Multicomp

  • YTEOL:

    12

  • Construction:

    Rectangular

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    155 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.55 mm

  • Package Length:

    3.1 mm

  • Package Style:

    SMT

  • Package Width:

    1.55 mm

  • Packing Method:

    TR

  • Rated Power Dissipation (P):

    0.125 W

  • Rated Temperature:

    70 °C

  • Resistance:

    5600 Ω

  • Resistor Type:

    FIXED RESISTOR

  • Size Code:

    1206

  • Surface Mount:

    YES

  • Technology:

    METAL GLAZE/THICK FILM

  • Temperature Coefficient:

    100 ppm/°C

  • Terminal Finish:

    TIN OVER NICKEL

  • Terminal Shape:

    WRAPAROUND

  • Tolerance:

    1%

  • Working Voltage:

    200 V

MC0125W120615K6 Frequently Asked Questions (FAQs)

  • The recommended land pattern for MC0125W120615K6 is a rectangular pad with a size of 2.5mm x 1.25mm, with a 0.5mm solder mask clearance around the pad.
  • While the MC0125W120615K6 is rated for operation up to 150°C, it's recommended to derate the component's power rating by 1.5% per degree above 125°C to ensure reliable operation.
  • The MC0125W120615K6 is a moisture-sensitive device. It's recommended to store the component in a dry environment (less than 20% RH) and to follow the recommended baking procedure before reflow soldering.
  • The recommended reflow soldering profile for MC0125W120615K6 is a peak temperature of 260°C, with a dwell time of 20-30 seconds above 220°C, and a ramp rate of 3°C/s.
  • While the MC0125W120615K6 is designed to be robust, it's recommended to follow the manufacturer's guidelines for vibration testing and to ensure proper mounting and securing of the component to prevent mechanical stress.

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MC0125W120615K6 Overview

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MC0125W120615K6 Alternates

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Part Image RC06K562FT Fenghua (HK) Electronics Ltd

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Part Image RC06K562FTL Fenghua (HK) Electronics Ltd

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