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MC06XS4200CFK - NXP

Description: High-Side Switch, 24V, Dual 6mOhms, PQFN23

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PCB Footprints
MC06XS4200CFK - NXP PCB footprint - Other - Other - SOT1938-1_2025-1
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3D Models
MC06XS4200CFK - NXP  - 3D model - Other - SOT1938-1_2025-1
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MC06XS4200CFK Details

  • Manufacturer Part Number:

    MC06XS4200CFK

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    26 Weeks

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    5

  • Interface IC Type:

    BUFFER OR INVERTER BASED PERIPHERAL DRIVER

  • Moisture Sensitivity Level:

    3

  • Peak Reflow Temperature (Cel):

    260

  • Time@Peak Reflow Temperature-Max (s):

    40

MC06XS4200CFK Frequently Asked Questions (FAQs)

  • NXP recommends a thermal pad on the bottom of the package, connected to a large copper area on the PCB to dissipate heat. A minimum of 2oz copper thickness is recommended, and the thermal pad should be connected to a ground plane to reduce thermal resistance.
  • To ensure reliable operation in high-temperature environments, it's essential to follow NXP's recommended thermal design guidelines, including proper heat sinking, thermal interface materials, and PCB layout. Additionally, consider using thermal simulation tools to analyze the design and identify potential hotspots.
  • The internal voltage regulator has a limited current capability and may not be suitable for high-current applications. If your design requires more than 100mA, it's recommended to use an external voltage regulator to ensure stable operation. Additionally, if you need a specific voltage or tighter voltage regulation, an external regulator may be necessary.
  • To optimize the device for low-power operation, use the lowest possible clock frequency, disable unused peripherals, and use the power-down mode when the device is not in use. Additionally, consider using a low-power oscillator and optimizing the PCB design to reduce power consumption.
  • To ensure EMC and EMI compliance, follow NXP's guidelines for PCB layout, component placement, and shielding. Use a multi-layer PCB with a solid ground plane, and consider using EMI filters and shielding cans to reduce emissions. Additionally, ensure that your design meets the relevant regulatory standards, such as FCC and CE.

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MC06XS4200CFK Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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