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MC0805S8F8200T5E - Multicomp Pro

Description: MULTICOMP - MC0805S8F8200T5E - RES, THICK FILM, 820R, 1%, 0.125W, 0805

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MC0805S8F8200T5E - Multicomp Pro PCB footprint - Resistor Chip - Resistor Chip - MC0805
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MC0805S8F8200T5E - Multicomp Pro  - 3D model - Resistor Chip - MC0805
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MC0805S8F8200T5E Details

  • Manufacturer Part Number:

    MC0805S8F8200T5E

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Unknown

  • ECCN Code:

    EAR99

  • HTS Code:

    8533.21.00.30

  • Manufacturer:

    SPC Multicomp

  • YTEOL:

    12

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    155 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.55 mm

  • Package Length:

    2 mm

  • Package Shape:

    RECTANGULAR PACKAGE

  • Package Style:

    SMT

  • Package Width:

    1.25 mm

  • Packing Method:

    TR

  • Rated Power Dissipation (P):

    0.125 W

  • Rated Temperature:

    70 °C

  • Resistance:

    820 Ω

  • Resistor Type:

    FIXED RESISTOR

  • Size Code:

    0805

  • Surface Mount:

    YES

  • Technology:

    METAL GLAZE/THICK FILM

  • Temperature Coefficient:

    100 ppm/°C

  • Terminal Finish:

    Tin (Sn) - with Nickel (Ni) barrier

  • Terminal Shape:

    WRAPAROUND

  • Tolerance:

    1%

  • Working Voltage:

    150 V

MC0805S8F8200T5E Frequently Asked Questions (FAQs)

  • The recommended land pattern for the MC0805S8F8200T5E is a rectangular pad with a size of 1.2mm x 1.4mm, with a solder mask clearance of 0.2mm. This ensures proper soldering and minimizes the risk of solder bridging.
  • While the MC0805S8F8200T5E is rated for operation up to 125°C, it's essential to consider the derating curve and ensure that the component does not exceed its maximum power rating at elevated temperatures. Additionally, the component's reliability and lifespan may be affected by prolonged exposure to high temperatures.
  • To prevent damage during assembly, handle the MC0805S8F8200T5E by the edges, avoiding touching the component's terminals or body. Use an anti-static wrist strap or mat to prevent electrostatic discharge (ESD) damage. Additionally, ensure that the component is properly seated on the PCB and that the soldering process is done according to the recommended profile.
  • The recommended soldering profile for the MC0805S8F8200T5E is a peak temperature of 260°C, with a dwell time of 10-30 seconds. The soldering process should be done using a solder with a melting point of 217°C to 220°C. It's essential to follow the recommended soldering profile to ensure reliable connections and prevent damage to the component.
  • While the MC0805S8F8200T5E is designed to operate in a variety of environments, it's essential to consider the component's moisture sensitivity level (MSL) rating. The MC0805S8F8200T5E has an MSL rating of 3, which means it can withstand some humidity, but it's still important to follow proper storage and handling procedures to prevent moisture-related damage.

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MC0805S8F8200T5E Overview

Use the download button to access the MC0805S8F8200T5E schematic symbol, PCB footprint, and 3D model.
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