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MC100ELT25DG - onsemi

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MC100ELT25DG - onsemi PCB footprint - Small Outline Packages - Small Outline Packages - SOIC-8 NB CAST 751-07
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MC100ELT25DG - onsemi  - 3D model - Small Outline Packages - SOIC-8 NB CAST 751-07
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MC100ELT25DG Details

  • Manufacturer Part Number:

    MC100ELT25DG

  • Brand Name:

    ON Semiconductor

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SOIC

  • Package Description:

    SOIC-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    751-07

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    4 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Delay-Max:

    4.1 ns

  • Input Characteristics:

    STANDARD

  • Interface IC Type:

    ECL TO TTL TRANSLATOR

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    4.9 mm

  • Moisture Sensitivity Level:

    1

  • Number of Bits:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    TOTEM-POLE

  • Output Latch or Register:

    NONE

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Supply Current-Max:

    18 mA

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    4.5 V

  • Supply Voltage-Nom:

    5 V

  • Supply Voltage1-Max:

    -5.7 V

  • Supply Voltage1-Min:

    -4.2 V

  • Supply Voltage1-Nom:

    -5 V

  • Surface Mount:

    YES

  • Technology:

    ECL

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.9 mm

MC100ELT25DG Frequently Asked Questions (FAQs)

  • A good PCB layout for the MC100ELT25DG involves keeping the input and output traces short and symmetrical, using a solid ground plane, and minimizing the distance between the device and the load. Additionally, it's recommended to use a low-ESR capacitor for power decoupling.
  • To ensure proper biasing, connect the VCC pin to a stable 2.5V power supply, and the VEE pin to a stable -2.5V power supply. The input common-mode voltage should be set to around 0V, and the output should be terminated with a 50Ω load to ensure optimal performance.
  • The MC100ELT25DG is specified to operate up to 2.5 GHz, but the actual operating frequency may be limited by the specific application and PCB layout. It's recommended to consult the datasheet and application notes for more information.
  • The MC100ELT25DG has a maximum junction temperature of 150°C. To ensure reliable operation, it's recommended to keep the device temperature below 125°C. This can be achieved by using a heat sink, improving air flow, and minimizing power consumption.
  • The MC100ELT25DG has built-in ESD protection, but it's still recommended to follow proper ESD handling procedures during assembly and testing. This includes using an ESD wrist strap, anti-static bags, and ESD-safe work surfaces.

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MC100ELT25DG Overview

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