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MC100EP52DR2G - onsemi

Description: 330ps Typical Propagation Delay; Maximum Frequency > 4 GHz Typical; PECL Mode: VCC = 3.0 V to 5.5 V with VEE = 0 V; NECL Mode: VCC = 0 V with VEE = -3.0 V to -5.5 V; Q Output will default LOW with inputs open or at VEE; Open Input Default State; Safety Clamp on Inputs; Pb-Free Packages are Available

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MC100EP52DR2G - onsemi PCB footprint - Small Outline Packages - Small Outline Packages - SOIC-8 NB CASE 751-07 ISSUE AK
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MC100EP52DR2G Details

  • Manufacturer Part Number:

    MC100EP52DR2G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC-8 Narrow Body

  • Package Description:

    SOP-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    751-07

  • Country Of Origin:

    Philippines

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    14 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    5

  • Additional Feature:

    NECL MODE: VCC = 0V WITH VEE = -3V TO -5.5V

  • Family:

    100E

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    4.9 mm

  • Load Capacitance (CL):

    50 pF

  • Logic IC Type:

    D FLIP-FLOP

  • Max Frequency@Nom-Sup:

    4000000000 Hz

  • Moisture Sensitivity Level:

    1

  • Number of Bits:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Polarity:

    COMPLEMENTARY

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power Supply Current-Max (ICC):

    47 mA

  • Prop. Delay@Nom-Sup:

    0.38 ns

  • Propagation Delay (tpd):

    0.38 ns

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    3 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    ECL

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Trigger Type:

    POSITIVE EDGE

  • Width:

    3.9 mm

  • fmax-Min:

    4000 MHz

MC100EP52DR2G Frequently Asked Questions (FAQs)

  • A good PCB layout for the MC100EP52DR2G should consider signal integrity, power supply decoupling, and thermal management. Keep the signal traces short and away from noise sources, use a solid ground plane, and decouple the power supply with capacitors. Additionally, ensure good thermal conductivity by using thermal vias and a heat sink if necessary.
  • The MC100EP52DR2G has a high power dissipation, so thermal management is crucial. Use a heat sink with a thermal interface material, ensure good airflow, and consider using thermal vias in the PCB. The device's junction temperature (Tj) should be kept below 150°C to ensure reliability and performance.
  • The MC100EP52DR2G requires a 50Ω input termination to ensure signal integrity and minimize reflections. Use a series resistor and a shunt capacitor to create an AC-coupled termination, and consider using a transmission line with a characteristic impedance of 50Ω.
  • While the MC100EP52DR2G is designed for 50Ω systems, it can be used in non-50Ω systems with proper impedance matching. Use a resistive divider or an impedance matching network to match the device's input impedance to the system's impedance, ensuring signal integrity and minimizing reflections.
  • To ensure EMC, use a shielded enclosure, keep the device away from noise sources, and use filtering or shielding on the input and output signals. Additionally, consider using a common-mode choke or a ferrite bead to reduce electromagnetic interference (EMI).

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MC100EP52DR2G Overview

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