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MC100LVELT22DR2G - onsemi

Description: <100ps Output-to-Output Skew; Flow Through Pinouts; ESD Protection: >4 KV HBM, >200 V MM; The 100 Series Contains Temperature Compensation; 350ps Typical Propagation Delay; LVPECL Operating Range: VCC= 3.15 V to 3.45 V with GND= 0 V; When Unused TTL Input is left Open, Q Output will Default High; Meets or Exceeds JEDEC Spec EIA/JESD78 IC Latchup Test; Moisture Sensitivity Level 1 For Additional Information, see Application Note AND8003/D; Flammability Rating: UL-94 code V-0 @ 1/8", Oxygen Index 28 to 34; Tr

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MC100LVELT22DR2G - onsemi - PCB symbol
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PCB Footprints
MC100LVELT22DR2G - onsemi PCB footprint - Small Outline Packages - Small Outline Packages - SOIC-8 NB CASE 751-07 ISSUE AK
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MC100LVELT22DR2G - onsemi - 3D model - Small Outline Packages - SOIC-8 NB CASE 751-07 ISSUE AK
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MC100LVELT22DR2G Details

  • Manufacturer Part Number:

    MC100LVELT22DR2G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC-8 Narrow Body

  • Package Description:

    SOIC-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    751-07

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    onsemi

  • YTEOL:

    5.61

  • Delay-Max:

    0.6 ns

  • Input Characteristics:

    DIFFERENTIAL

  • Interface IC Type:

    TTL/CMOS TO PECL TRANSLATOR

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    4.9 mm

  • Moisture Sensitivity Level:

    1

  • Number of Bits:

    1

  • Number of Functions:

    2

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    OPEN-EMITTER

  • Output Latch or Register:

    NONE

  • Output Polarity:

    COMPLEMENTARY

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Supply Current-Max:

    29 mA

  • Supply Voltage-Max:

    3.8 V

  • Supply Voltage-Min:

    3 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    ECL

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.9 mm

MC100LVELT22DR2G Frequently Asked Questions (FAQs)

  • A good PCB layout for the MC100LVELT22DR2G involves keeping the input and output traces as short as possible, using a solid ground plane, and minimizing the distance between the device and the bypass capacitors. It's also recommended to use a 4-layer PCB with a dedicated power plane and a dedicated ground plane.
  • To ensure proper biasing, make sure to connect the VCC pin to a stable 3.3V power supply, and the GND pin to a solid ground plane. Also, ensure that the input signals are within the recommended voltage range of 0V to VCC, and that the output loads are within the recommended range of 10kΩ to 100kΩ.
  • The maximum operating frequency of the MC100LVELT22DR2G is 100 MHz. However, the actual operating frequency may be limited by the specific application and the quality of the PCB layout.
  • To handle ESD protection for the MC100LVELT22DR2G, it's recommended to use a TVS (Transient Voltage Suppressor) diode or a Zener diode on the input pins, and to follow proper ESD handling procedures during assembly and testing.
  • The recommended thermal management strategy for the MC100LVELT22DR2G involves using a heat sink or a thermal pad on the exposed pad of the device, and ensuring good airflow around the device. The maximum junction temperature of the device is 150°C.

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MC100LVELT22DR2G Overview

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