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MC100LVEP210FARG - onsemi

Description: Maximum Frequency >3 Ghz; NECL Mode Operating Range: VCC = 0 V with VEE = -2.375 V to -3.8 V; 85 ps Typical Device-to-Device Skew; VBBOutput; PECL and HSTL Mode Operating Range: VCC = 2.375 V to 3.8 V with VEE = 0 V; 350 ps Typical Propagation Delay; 20 ps Typical Output-to-Output Skew; Jitter Less than 1 ps RMS; The 100 Series Contains Temperature Compensation; Open Input Default State; LVDS Input Compatible

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MC100LVEP210FARG - onsemi PCB footprint - Quad Flat Packages - Quad Flat Packages - LQFP-32 7x7 CASE 561AB
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MC100LVEP210FARG - onsemi  - 3D model - Quad Flat Packages - LQFP-32 7x7 CASE 561AB
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MC100LVEP210FARG Details

  • Manufacturer Part Number:

    MC100LVEP210FARG

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    32 LEAD LQFP 7x7, 0.8P

  • Package Description:

    LQFP-32

  • Pin Count:

    32

  • Manufacturer Package Code:

    561AB

  • Country Of Origin:

    Mainland China

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    14 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    6.4

  • Additional Feature:

    NECL MODE: VCC = 0V WITH VEE = -2.375V TO -3.8V

  • Family:

    100LVE

  • Input Conditioning:

    DIFFERENTIAL

  • JESD-30 Code:

    S-PQFP-G32

  • JESD-609 Code:

    e3

  • Length:

    7 mm

  • Logic IC Type:

    LOW SKEW CLOCK DRIVER

  • Moisture Sensitivity Level:

    2

  • Number of Functions:

    2

  • Number of Terminals:

    32

  • Number of True Outputs:

    5

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LQFP

  • Package Equivalence Code:

    QFP32,.35SQ,32

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK, LOW PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Prop. Delay@Nom-Sup:

    0.75 ns

  • Propagation Delay (tpd):

    0.43 ns

  • Qualification Status:

    Not Qualified

  • Same Edge Skew-Max (tskwd):

    0.025 ns

  • Seated Height-Max:

    1.6 mm

  • Supply Voltage-Max (Vsup):

    3.8 V

  • Supply Voltage-Min (Vsup):

    2.375 V

  • Supply Voltage-Nom (Vsup):

    2.5 V

  • Surface Mount:

    YES

  • Technology:

    ECL

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    7 mm

MC100LVEP210FARG Frequently Asked Questions (FAQs)

  • The recommended PCB layout for the MC100LVEP210FARG involves keeping the input and output traces as short as possible, using a solid ground plane, and minimizing the distance between the device and the load. Additionally, it's recommended to use a 50-ohm transmission line for the input and output signals.
  • The MC100LVEP210FARG has a maximum junction temperature of 150°C. To handle thermal management, it's recommended to use a heat sink or a thermal pad, and to ensure good airflow around the device. The thermal resistance of the package is 25°C/W, so it's essential to calculate the junction temperature rise based on the power dissipation and thermal resistance.
  • The MC100LVEP210FARG is a differential ECL device, and it requires proper termination to ensure signal integrity. The recommended input termination is a 50-ohm resistor in series with a 50-ohm resistor to VCC, and the recommended output termination is a 50-ohm resistor to VCC or VEE.
  • To ensure signal integrity with the MC100LVEP210FARG, it's recommended to use a controlled impedance PCB, minimize the distance between the device and the load, and use a signal integrity analysis tool to simulate the signal transmission. Additionally, it's essential to follow the recommended input and output termination schemes and to use a common mode filter if necessary.
  • The MC100LVEP210FARG requires a stable power supply to ensure proper operation. It's recommended to use a 0.1uF ceramic capacitor in parallel with a 10uF tantalum capacitor for power supply decoupling. The capacitors should be placed as close as possible to the device's power pins.

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MC100LVEP210FARG Overview

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