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MC10EP52DTG - onsemi

Description: Flip Flop 1 Element D-Type 1 Bit Positive, Negative 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)

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MC10EP52DTG - onsemi PCB footprint - Small Outline Packages - Small Outline Packages - TSSOP−8 3.00x3.00x0.95 CASE 948R−02
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MC10EP52DTG - onsemi  - 3D model - Small Outline Packages - TSSOP−8 3.00x3.00x0.95 CASE 948R−02
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MC10EP52DTG Details

  • Manufacturer Part Number:

    MC10EP52DTG

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TSSOP 8 3.0x3.0x0.95 mm

  • Package Description:

    TSSOP-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    948R-02

  • Country Of Origin:

    Malaysia

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    18 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    4.85

  • Additional Feature:

    NECL MODE: VCC = 0V WITH VEE = -3V TO -5.5V

  • Family:

    10E

  • JESD-30 Code:

    S-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Load Capacitance (CL):

    50 pF

  • Logic IC Type:

    D FLIP-FLOP

  • Max Frequency@Nom-Sup:

    4000000000 Hz

  • Moisture Sensitivity Level:

    3

  • Number of Bits:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Polarity:

    COMPLEMENTARY

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TUBE

  • Peak Reflow Temperature (Cel):

    260

  • Power Supply Current-Max (ICC):

    47 mA

  • Prop. Delay@Nom-Sup:

    0.38 ns

  • Propagation Delay (tpd):

    0.38 ns

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.1 mm

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    3 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    ECL

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Trigger Type:

    POSITIVE EDGE

  • Width:

    3 mm

  • fmax-Min:

    4000 MHz

MC10EP52DTG Frequently Asked Questions (FAQs)

  • A good PCB layout for the MC10EP52DTG involves keeping the input and output traces short and symmetrical, using a solid ground plane, and minimizing noise coupling. It's also recommended to use a low-ESR capacitor for power decoupling and to keep the device away from high-current or high-voltage traces.
  • Proper termination for high-speed signals involves using a termination resistor that matches the impedance of the transmission line. For the MC10EP52DTG, a 50-ohm termination resistor is recommended. Additionally, the termination resistor should be placed as close to the device as possible to minimize signal reflections.
  • The MC10EP52DTG has an operating temperature range of -40°C to 125°C. However, it's recommended to operate the device within a temperature range of 0°C to 85°C for optimal performance and reliability.
  • The MC10EP52DTG has built-in ESD protection, but it's still recommended to take precautions during handling and assembly. Use an ESD wrist strap or mat, and avoid touching the device's pins or exposed metal surfaces. Additionally, use ESD-protected packaging and storage materials.
  • The recommended power-up sequence for the MC10EP52DTG is to apply power to the VCC pin first, followed by the input signals. This ensures that the device is properly initialized and configured before the input signals are applied.

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MC10EP52DTG Overview

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