Part Image

MC10EP56DTG - onsemi

Description: VBB Outputs; Q Output will default LOW with inputs open or at VEE; 360ps Typical Propagation Delays; Separate and Common Select; NECL Mode Operating Range: VCC = 0 V with VEE = -3.0 V to -5.5 V; Maximum Frequency > 3 GHz Typical; PECL Mode Operating Range: VCC = 3.0 V to 5.5 V with VEE = 0 V; Open Input Default State; Safety Clamp on Inputs; Pb-Free Packages are Available

Download MC10EP56DTG Model
Schematic
symbols
Schematic symbol is unavailable for download
PCB
footprints
PCB footprint is unavailable for download
3D
models
3D model is unavailable for download
PCB Footprints
MC10EP56DTG - onsemi PCB footprint - Small Outline Packages - Small Outline Packages - TSSOP-20 CASE 948E-02 ISSUE C
click to zoom
3D Models
MC10EP56DTG - onsemi  - 3D model - Small Outline Packages - TSSOP-20 CASE 948E-02 ISSUE C
click to zoom

MC10EP56DTG Details

  • Manufacturer Part Number:

    MC10EP56DTG

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TSSOP 20 LEAD

  • Package Description:

    SO-20

  • Pin Count:

    20

  • Manufacturer Package Code:

    9.48

  • Country Of Origin:

    Philippines

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    13 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    4.85

  • Additional Feature:

    NECL MODE OPERATING RANGE: VCC = 0 V WITH VEE = -3.0 V TO -5.5 V

  • Family:

    10E

  • JESD-30 Code:

    R-PDSO-G20

  • JESD-609 Code:

    e4

  • Length:

    6.5 mm

  • Logic IC Type:

    MULTIPLEXER

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    2

  • Number of Inputs:

    2

  • Number of Outputs:

    1

  • Number of Terminals:

    20

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    SERIES-RESISTOR

  • Output Polarity:

    COMPLEMENTARY

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP20,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    RAIL

  • Peak Reflow Temperature (Cel):

    260

  • Power Supply Current-Max (ICC):

    78 mA

  • Prop. Delay@Nom-Sup:

    0.5 ns

  • Propagation Delay (tpd):

    0.47 ns

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.2 mm

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    3 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    ECL

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    4.4 mm

MC10EP56DTG Frequently Asked Questions (FAQs)

  • A good PCB layout for the MC10EP56DTG involves keeping the input and output traces short and symmetrical, using a solid ground plane, and placing bypass capacitors close to the device. A 4-layer PCB with a dedicated power plane and a separate ground plane is recommended.
  • To ensure signal integrity, use controlled impedance traces, keep the signal paths short, and avoid vias and stubs. Also, use a termination resistor at the receiving end, and consider using a signal integrity model to simulate and optimize the design.
  • The MC10EP56DTG is specified to operate up to 3.2 Gbps, but the actual maximum frequency depends on the specific application, PCB layout, and signal quality. In general, it's recommended to derate the frequency by 10-20% to ensure reliable operation.
  • The MC10EP56DTG requires a specific power sequencing order: VCC, then VEE. The device can tolerate a supply voltage range of 3.3V ± 10%. Ensure that the power supply is stable and well-regulated to prevent voltage droop or overshoot.
  • The MC10EP56DTG has a thermal resistance of 45°C/W. To manage thermal performance, use a heat sink or thermal pad, ensure good airflow, and avoid blocking the airflow around the device. Also, consider using a thermal interface material to improve heat transfer.

Trust Checks

This model has been built in collaboration with the manufacturer.
Manufacturer Collaborated
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored

MC10EP56DTG Overview

Use the download button to access the MC10EP56DTG schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like MC10E, or try a keyword search, such as Multiplexer/Demultiplexers

Parts related to MC10EP56DTG

Showing 0 results

MC10EP56DTG Alternates

Showing results

Image Part Number Model
Part Image MC10EP56DTR2G onsemi

10E Series, 2-Func, 2 Line Input, 1 Line Output, Complementary Output, ECL, PDSO20