Description:Q Output will default LOW with inputs open or at VEE; 1.6V (5V) and 1.4V (3.3V) VOUTpp Swing; PECL Mode Operating Range: VCC= 3.0 V to 5.5 V with VEE= 0 V; Maximum Frequency > 2 Ghz Typical; NECL Mode Operating Range: VCC= 0 V with VEE= -3.0 V to -5.5 V; 310ps Typical Propagation Delay; Open Input Default State; Safety Clamp on Inputs; Pb-Free Packages are Available
CAN ALSO OPERATE WITH -3V TO -5.5V SUPPLY IN NECL MODE
Differential Output:
YES
Driver Number of Bits:
1
High Level Input Current-Max:
0.00015 A
Input Characteristics:
DIFFERENTIAL
Interface IC Type:
LINE DRIVER
Interface Standard:
GENERAL PURPOSE
JESD-30 Code:
R-PDSO-G8
JESD-609 Code:
e3
Length:
3 mm
Moisture Sensitivity Level:
3
Number of Functions:
1
Number of Terminals:
8
Operating Temperature-Max:
85 °C
Operating Temperature-Min:
-40 °C
Out Swing-Min:
1.4 V
Package Body Material:
PLASTIC/EPOXY
Package Code:
TSSOP
Package Equivalence Code:
TSSOP8,.19
Package Shape:
RECTANGULAR
Package Style:
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Cel):
260
Qualification Status:
Not Qualified
Seated Height-Max:
1.1 mm
Supply Voltage-Max:
5.5 V
Supply Voltage-Min:
3 V
Supply Voltage-Nom:
3.3 V
Surface Mount:
YES
Technology:
ECL
Temperature Grade:
INDUSTRIAL
Terminal Finish:
Matte Tin (Sn) - annealed
Terminal Form:
GULL WING
Terminal Pitch:
0.65 mm
Terminal Position:
DUAL
Time@Peak Reflow Temperature-Max (s):
30
Transmit Delay-Max:
0.37 ns
Width:
3 mm
MC10EP89DTR2G Frequently Asked Questions (FAQs)
A good PCB layout for the MC10EP89DTR2G involves keeping the input and output traces short and symmetrical, using a solid ground plane, and minimizing vias and layer changes. It's also recommended to use a low-impedance power supply and to decouple the power pins with capacitors.
Proper termination for the MC10EP89DTR2G involves using a combination of series and parallel termination resistors to match the impedance of the transmission line. The datasheet provides guidelines for termination, but it's essential to consult with a signal integrity expert or use simulation tools to ensure optimal termination.
The MC10EP89DTR2G has a relatively high power dissipation, so thermal management is crucial. Ensure good airflow around the device, use a heat sink if necessary, and follow the recommended PCB layout guidelines to minimize thermal resistance. Monitor the junction temperature to prevent overheating.
Output skew and jitter can be minimized by using a low-jitter clock source, ensuring proper termination, and using a clock distribution network with low skew. Additionally, the MC10EP89DTR2G has built-in features like output deskew and jitter reduction, which can be enabled through the device's configuration pins.
The MC10EP89DTR2G has built-in ESD protection, but it's still essential to follow proper ESD handling procedures during assembly and testing. Use ESD-safe materials, handle the device by the body or pins, and avoid touching the pins or exposed die.
Trust Checks
This model has been built in collaboration with the manufacturer.
Manufacturer Collaborated
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored
MC10EP89DTR2G Overview
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