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MC32PF1550A0EP - NXP

Description: High Reliability PMIC Solution IC

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PCB Footprints
MC32PF1550A0EP - NXP PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - QFN 40
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3D Models
MC32PF1550A0EP - NXP  - 3D model - Quad Flat No-Lead - QFN 40
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MC32PF1550A0EP Details

  • Manufacturer Part Number:

    MC32PF1550A0EP

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    QFN-40

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    16 Weeks

  • Date Of Intro:

    2018-09-28

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    5

  • Adjustable Threshold:

    YES

  • Analog IC - Other Type:

    INTEGRATED POWER MANAGEMENT UNIT

  • JESD-30 Code:

    S-PQCC-N40

  • JESD-609 Code:

    e4

  • Length:

    5 mm

  • Moisture Sensitivity Level:

    3

  • Number of Channels:

    7

  • Number of Functions:

    1

  • Number of Terminals:

    40

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    QCCN

  • Package Equivalence Code:

    LCC40,.2SQ,16

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    0.9 mm

  • Supply Voltage-Max (Vsup):

    4.5 V

  • Supply Voltage-Min (Vsup):

    2.5 V

  • Supply Voltage-Nom (Vsup):

    3.6 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.4 mm

  • Terminal Position:

    QUAD

  • Threshold Voltage-Nom:

    +6.5V

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    5 mm

MC32PF1550A0EP Frequently Asked Questions (FAQs)

  • NXP provides a recommended PCB layout and thermal management guide in their application note AN12255. It's essential to follow these guidelines to ensure optimal performance, thermal dissipation, and to prevent overheating.
  • To minimize power consumption, configure the device to use the lowest possible clock frequency, disable unused peripherals, and use the power-saving modes (e.g., Sleep, Deep Sleep, or Power Down). Additionally, optimize the voltage regulator settings and use a low-power oscillator.
  • To ensure EMC and minimize EMI, follow NXP's guidelines for PCB layout, component placement, and shielding. Use a ground plane, decouple power supplies, and add EMI filters as needed. Also, ensure that the device is properly configured to minimize radiated emissions.
  • NXP provides a Secure Boot and Secure Firmware Update solution using their Bootloader and Secure Firmware Update tools. Implementing secure boot and firmware updates requires a deep understanding of the device's security features, such as the Secure Boot mechanism, encryption, and digital signatures.
  • The MC32PF1550A0EP is designed for industrial and automotive applications, but it's essential to consider the operating temperature range, humidity, and vibration tolerance. Ensure that the device is properly packaged, sealed, and protected from environmental stressors to prevent damage or malfunction.

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MC32PF1550A0EP Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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