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MC33074DTBR2G - onsemi

Description: High Slew Rate: 13 V/µs; Large Output Voltage Swing: -14.7 V to +14 V (with +/-15 V Supplies); Excellent Gain Margin: 12 dB; Wide Bandwidth: 4.5 MHz; Fast Settling Time: 1.1 µs to 0.1%; Low Input Offset Voltage: 3.0 mV Maximum (A Suffix); Output Short Circuit Protection; Large Capacitance Drive Capability: 0 pF to 10,000 pF; Low Total Harmonic Distortion: 0.02%; Excellent Phase Margin: 60° Wide Input Common Mode Voltage Range: Includes Ground (VEE); Wide Single Supply Operation: 3.0 V to 44 V

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MC33074DTBR2G - onsemi PCB footprint - Small Outline Packages - Small Outline Packages - TSSOP14 CASE 948G
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MC33074DTBR2G - onsemi  - 3D model - Small Outline Packages - TSSOP14 CASE 948G
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MC33074DTBR2G Details

  • Manufacturer Part Number:

    MC33074DTBR2G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TSSOP-14

  • Pin Count:

    14

  • Manufacturer Package Code:

    948G

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Factory Lead Time:

    9 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    4.15

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.7 µA

  • Bias Current-Max (IIB) @25C:

    0.5 µA

  • Common-mode Reject Ratio-Nom:

    97 dB

  • Frequency Compensation:

    YES

  • Input Offset Voltage-Max:

    7000 µV

  • JESD-30 Code:

    R-PDSO-G14

  • JESD-609 Code:

    e4

  • Length:

    5 mm

  • Low-Offset:

    NO

  • Moisture Sensitivity Level:

    1

  • Neg Supply Voltage Limit-Max:

    -22 V

  • Neg Supply Voltage-Nom (Vsup):

    -15 V

  • Number of Functions:

    4

  • Number of Terminals:

    14

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP14,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TAPE AND REEL

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.2 mm

  • Slew Rate-Min:

    8 V/us

  • Slew Rate-Nom:

    10 V/us

  • Supply Current-Max:

    11.2 mA

  • Supply Voltage Limit-Max:

    22 V

  • Supply Voltage-Nom (Vsup):

    15 V

  • Surface Mount:

    YES

  • Technology:

    BIPOLAR

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    4500

  • Voltage Gain-Min:

    20000

  • Width:

    4.4 mm

MC33074DTBR2G Frequently Asked Questions (FAQs)

  • A good PCB layout for the MC33074DTBR2G involves keeping the input and output traces short and separate, using a solid ground plane, and placing decoupling capacitors close to the device. A 4-layer PCB with a dedicated power plane and a solid ground plane is recommended.
  • To ensure stability, make sure to follow the recommended component values and PCB layout guidelines. Also, ensure that the input and output capacitors are of high quality and have low ESR. Additionally, a minimum of 10uF capacitance is recommended at the output.
  • The MC33074DTBR2G is rated for operation from -40°C to 125°C. However, the device's performance may degrade at higher temperatures, and the maximum junction temperature should not exceed 150°C.
  • Yes, the MC33074DTBR2G is designed to meet the requirements of CISPR 25 and is suitable for use in automotive and industrial applications where high EMI immunity is required.
  • The recommended input voltage range for the MC33074DTBR2G is 7V to 18V. Operating the device outside of this range may affect its performance and reliability.

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MC33074DTBR2G Overview

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