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MC33261 - Multicomp Pro

Description: MULTICOMP - MC33261 - HEATSINK TO220/218 16.7°C/W

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MC33261 - Multicomp Pro  - 3D model
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MC33261 Details

  • Manufacturer Part Number:

    MC33261

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.90.00.00

  • Manufacturer:

    SPC Multicomp

  • YTEOL:

    8

  • Body Material:

    ALUMINUM

  • Color:

    BLACK

  • Construction:

    EXTRUDED

  • Device Used On:

    TRANSISTOR

  • Fin Orientation:

    LONGITUDINAL

  • Finish:

    ANODIZED

  • Height:

    25.4 mm

  • Length:

    16.6 mm

  • Thermal Resistance:

    16.7 Ω

  • Thermal Support Device Type:

    HEAT SINK

  • Width:

    16.26 mm

MC33261 Frequently Asked Questions (FAQs)

  • A good PCB layout is crucial for the MC33261. Ensure that the input and output capacitors are placed close to the IC, and the input voltage lines are separated from the output voltage lines to minimize noise. Also, use a solid ground plane and keep the layout symmetrical to reduce electromagnetic interference (EMI).
  • Choose input capacitors with low ESR (Equivalent Series Resistance) and high ripple current rating to minimize voltage drops and ensure stable operation. For output capacitors, select ones with low ESR and high capacitance to filter out ripple and noise. A good starting point is to use 10uF to 22uF capacitors for both input and output.
  • Although the datasheet specifies a maximum input voltage of 18V, it's recommended to keep the input voltage below 15V to ensure reliable operation and prevent overheating. Exceeding 15V may reduce the IC's lifespan or cause it to fail.
  • The output voltage ripple can be calculated using the formula: ΔVout = (Iout * ESR) / (f * C), where Iout is the output current, ESR is the output capacitor's equivalent series resistance, f is the switching frequency, and C is the output capacitance. Aim for a ripple voltage of less than 1% of the output voltage for most applications.
  • The thermal derating curve is not explicitly provided in the datasheet. However, as a general guideline, the IC's power dissipation should be derated by 1.5% to 2% per degree Celsius above 25°C to ensure reliable operation and prevent overheating.

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MC33261 Overview

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