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MC33269DT-012G - onsemi

Description: LDO Regulator, 800 mA Vout: 12 V

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MC33269DT-012G Details

  • Manufacturer Part Number:

    MC33269DT-012G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    DPAK (SINGLE GAUGE) TO-252

  • Package Description:

    DPAK-3

  • Pin Count:

    3

  • Manufacturer Package Code:

    369C

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    2 Days

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Adjustability:

    FIXED

  • Dropout Voltage1-Max:

    1.35 V

  • Dropout Voltage1-Nom:

    1.1 V

  • Input Voltage Absolute-Max:

    20 V

  • Input Voltage-Max:

    20 V

  • Input Voltage-Min:

    13.5 V

  • JESD-30 Code:

    R-PSSO-G2

  • JESD-609 Code:

    e3

  • Length:

    6.54 mm

  • Line Regulation-Max:

    0.036%

  • Load Regulation-Max:

    0.06%

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Outputs:

    1

  • Number of Terminals:

    2

  • Operating Temperature TJ-Max:

    150 °C

  • Operating Temperature TJ-Min:

    -40 °C

  • Output Current1-Max:

    0.8 A

  • Output Voltage1-Max:

    12.24 V

  • Output Voltage1-Min:

    11.76 V

  • Output Voltage1-Nom:

    12 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TO-252

  • Package Equivalence Code:

    SMSIP3H,.38,90TB

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    RAIL

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Regulator Type:

    FIXED POSITIVE SINGLE OUTPUT LDO REGULATOR

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    2.38 mm

  • Surface Mount:

    YES

  • Technology:

    BIPOLAR

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    2.29 mm

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Voltage Tolerance-Max:

    2%

  • Width:

    6.095 mm

MC33269DT-012G Frequently Asked Questions (FAQs)

  • A thermal pad is recommended under the package to improve thermal performance. A minimum of 2 oz copper thickness and a thermal relief pattern are recommended. Refer to the onsemi application note AND8031/D for more details.
  • The device requires a power-up sequence of VCC, then VIO, and finally EN. The EN pin should be tied to VCC through a resistor to ensure proper startup. Refer to the datasheet for the recommended power-up sequence and configuration.
  • The device can drive up to 100 pF of capacitive load. Exceeding this limit may affect the device's stability and performance.
  • The device has a built-in thermal shutdown feature that activates when the junction temperature exceeds 150°C. When this occurs, the device will shut down and restart when the temperature drops below 140°C. Ensure proper thermal design and heat sinking to prevent thermal shutdown.
  • A 1-10 μF ceramic capacitor is recommended for the input capacitor. The capacitor should be placed as close to the device as possible to minimize noise and ensure stability.

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MC33269DT-012G Overview

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