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MC33660BEF - NXP

Description: Interface - Specialized Transceiver, Physical layer, ISO9141 K Line Serial Link Interface, SOIC 8

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Symbol
MC33660BEF - NXP - PCB symbol
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PCB Footprints
MC33660BEF - NXP PCB footprint - Small Outline Packages - Small Outline Packages - 8 - SOIC
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3D Models
MC33660BEF - NXP - 3D model - Small Outline Packages - 8 - SOIC
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MC33660BEF Details

  • Manufacturer Part Number:

    MC33660BEF

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    ROHS COMPLIANT, PLASTIC, MS-012AA, SOICN-8

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    1

  • JESD-30 Code:

    R-PDSO-N8

  • JESD-609 Code:

    e3

  • Length:

    4.9 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SON

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1.75 mm

  • Supply Voltage-Nom:

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Telecom IC Type:

    TELECOM CIRCUIT

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    3.9 mm

MC33660BEF Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the high-current paths short and wide, and use thermal vias to dissipate heat. Refer to the NXP application note AN4868 for more details.
  • Choose an inductor with a high saturation current rating, low DC resistance, and a suitable inductance value (e.g., 1-10 μH). Consider the peak current, switching frequency, and output voltage when selecting the inductor. Refer to the NXP application note AN4868 for inductor selection guidelines.
  • The maximum ambient temperature for the MC33660BEF is 105°C. However, the device can operate up to 150°C junction temperature. Ensure proper thermal design and heat dissipation to prevent overheating.
  • Use the OCSET pin to set the overcurrent threshold. Connect a resistor (Rocset) between the OCSET pin and the output voltage (Vout). The overcurrent threshold is calculated as Vout / Rocset. Use a suitable value for Rocset to set the desired overcurrent threshold.
  • Yes, the MC33660BEF can be used in a synchronous rectification configuration. This can improve efficiency and reduce power losses. However, ensure proper design and layout to minimize parasitic inductance and capacitance.

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MC33660BEF Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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