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MC33662BLEFR2 - NXP

Description: LIN Transceivers Transceiver, Physical Layer, LIN 2.1 / SAEJ2602-2, 20 kbps, TX/RX symmetry, SOIC 8

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Symbol
MC33662BLEFR2 - NXP - PCB symbol
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PCB Footprints
MC33662BLEFR2 - NXP PCB footprint - Small Outline Packages - Small Outline Packages - 8-SOICN
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3D Models
MC33662BLEFR2 - NXP - 3D model - Small Outline Packages - 8-SOICN
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MC33662BLEFR2 Details

  • Manufacturer Part Number:

    MC33662BLEFR2

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    ROHS COMPLIANT, MS-012AA, SOIC-8

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    26 Weeks

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    1

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    4.9 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1.75 mm

  • Supply Voltage-Nom:

    13.5 V

  • Surface Mount:

    YES

  • Telecom IC Type:

    INTERFACE CIRCUIT

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    3.9 mm

MC33662BLEFR2 Frequently Asked Questions (FAQs)

  • A good thermal design should include a solid ground plane, thermal vias, and a heat sink. The datasheet provides some guidelines, but a more detailed application note (AN) or a thermal simulation tool can help optimize the design.
  • Follow the guidelines in the datasheet and application notes for PCB layout, component selection, and shielding. Additionally, perform EMC testing and simulation to ensure compliance with relevant standards.
  • NXP provides a test and measurement guide, which includes procedures for characterizing the device's electrical and thermal performance. Additionally, use industry-standard test equipment and follow best practices for measurement setup and data analysis.
  • Implement external OVP and OCP circuits, such as zener diodes and current-sensing resistors, to protect the device from voltage and current surges. The datasheet provides some guidance, but additional design considerations and simulations may be necessary.
  • Use thermal interface materials, heat sinks, and fans to manage heat generation. Perform thermal simulations and testing to ensure the device operates within its thermal specifications. Consider using a thermal design tool to optimize the design.

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MC33662BLEFR2 Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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