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MC33907LAE - NXP

Description: Power Management Specialized - PMIC MC33907LAE/HLQFP48///STANDARD MARKING * TRAY DRY P

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Symbol
MC33907LAE - NXP - PCB symbol
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PCB Footprints
MC33907LAE - NXP PCB footprint - Quad Flat Packages - Quad Flat Packages - 98ASA001730
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3D Models
MC33907LAE - NXP - 3D model - Quad Flat Packages - 98ASA001730
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MC33907LAE Details

  • Manufacturer Part Number:

    MC33907LAE

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    7 X 7 MM, 1.40 MM HEIGHT, 0.50 MM PITCH, ROHS COMPLIANT, MS-026BBC, LQFP-48

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    5.13

  • JESD-30 Code:

    S-PQFP-G48

  • JESD-609 Code:

    e3

  • Length:

    7 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    48

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HLFQFP

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1.6 mm

  • Surface Mount:

    YES

  • Telecom IC Type:

    INTERFACE CIRCUIT

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    7 mm

MC33907LAE Frequently Asked Questions (FAQs)

  • The maximum current rating of the MC33907LAE is 5A per channel, but it can be limited by the PCB design and thermal considerations.
  • The MC33907LAE can be configured for high-side or low-side switching by connecting the VCC pin to the desired voltage rail and configuring the EN pin accordingly. Refer to the application note AN4836 for more details.
  • The diagnostic pins (nD1 and nD2) provide fault detection and diagnostic information, such as overcurrent, overtemperature, and undervoltage detection. They can be used to implement fault-tolerant designs.
  • To ensure EMC with the MC33907LAE, follow proper PCB design guidelines, use a common mode choke, and add EMI filters as needed. Refer to the application note AN11335 for more details.
  • The thermal resistance of the MC33907LAE package is 25°C/W (junction-to-ambient) and 10°C/W (junction-to-case). Proper thermal design and heat sinking are essential to ensure reliable operation.

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MC33907LAE Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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