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MC33CD1030AER2 - NXP

Description: Interface - Specialized 33 channel, Mono, 48

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MC33CD1030AER2 - NXP - PCB symbol
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PCB Footprints
MC33CD1030AER2 - NXP PCB footprint - Quad Flat Packages - Quad Flat Packages - SOT1571-1_2025
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3D Models
MC33CD1030AER2 - NXP - 3D model - Quad Flat Packages - SOT1571-1_2025
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MC33CD1030AER2 Details

  • Manufacturer Part Number:

    MC33CD1030AER2

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    9

  • Interface IC Type:

    INTERFACE CIRCUIT

  • JESD-30 Code:

    S-PQFP-G48

  • Length:

    7 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    48

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HLFQFP

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1.6 mm

  • Supply Voltage-Max:

    36 V

  • Supply Voltage-Min:

    4.5 V

  • Supply Voltage-Nom:

    16 V

  • Surface Mount:

    YES

  • Technology:

    SMARTMOS

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    7 mm

MC33CD1030AER2 Frequently Asked Questions (FAQs)

  • A good PCB layout for the MC33CD1030AER2 involves placing the device near the power source, using a solid ground plane, and keeping the input and output traces short and separate to minimize noise and EMI.
  • To ensure proper power-up and initialization, follow the recommended power-up sequence, ensure the input voltage is within the specified range, and add a capacitor to the EN pin to prevent unwanted resets.
  • The MC33CD1030AER2 has a thermal pad that must be connected to a solid ground plane to dissipate heat. Ensure good thermal conductivity between the device and the PCB, and consider using thermal vias or a heat sink for high-power applications.
  • To troubleshoot issues, check the input voltage, output voltage, and current consumption. Use an oscilloscope to verify the switching frequency and output waveform. Consult the datasheet and application notes for guidance on specific issues.
  • Yes, the MC33CD1030AER2 is qualified for automotive and high-reliability applications. However, ensure that the device is used within its specified operating conditions, and follow the recommended design and manufacturing guidelines for these applications.

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MC33CD1030AER2 Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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