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MC33FS4500LAE - NXP

Description: Power Management Specialized - PMIC System Basis Chip, Linear 0.5A Vcore, CAN, LIN, LQFP48EP

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Symbol
MC33FS4500LAE - NXP - PCB symbol
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PCB Footprints
MC33FS4500LAE - NXP PCB footprint - Quad Flat Packages - Quad Flat Packages - SOT1571-1
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3D Models
MC33FS4500LAE - NXP - 3D model - Quad Flat Packages - SOT1571-1
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MC33FS4500LAE Details

  • Manufacturer Part Number:

    MC33FS4500LAE

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    LQFP-48

  • Country Of Origin:

    Mainland China

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    10

  • JESD-30 Code:

    S-PQFP-G48

  • Length:

    7 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    48

  • Number of Transceivers:

    1

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HLFQFP

  • Package Equivalence Code:

    QFP48,.35SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1.6 mm

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    SMARTMOS

  • Telecom IC Type:

    CAN FD/LIN TRANSCEIVER

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    7 mm

MC33FS4500LAE Frequently Asked Questions (FAQs)

  • NXP provides a recommended PCB layout guide in the MC33FS4500LAE application note (AN12213) which includes guidelines for component placement, routing, and thermal management to ensure optimal performance and minimize electromagnetic interference (EMI).
  • The MC33FS4500LAE has multiple operating modes, including buck, boost, and buck-boost modes. Configuration is done through the device's registers, which can be accessed through the I2C interface. NXP provides a detailed register map and configuration guide in the device's datasheet and application notes.
  • While the datasheet specifies a maximum input voltage of 18V, it's essential to consider the device's absolute maximum ratings, which include a maximum input voltage of 20V. However, operating the device at this voltage may reduce its reliability and lifespan. It's recommended to operate the device within the recommended input voltage range of 4.5V to 18V for optimal performance and reliability.
  • To ensure EMC compliance, follow NXP's guidelines for PCB layout, component selection, and shielding. Additionally, perform EMC testing and certification according to relevant industry standards, such as CISPR 25 and IEC 62133. NXP provides EMC-related information and resources on their website.
  • The MC33FS4500LAE has a thermal pad on the bottom of the package, which should be connected to a thermal ground plane on the PCB to dissipate heat efficiently. NXP recommends using thermal vias and a heat sink, if necessary, to keep the device's junction temperature within the recommended operating range.

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MC33FS4500LAE Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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