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MC33FS4501CAE - NXP

Description: Power Management Specialized - PMIC System Basis Chip, Linear 0.5A Vcore, FS1b, CAN, LQFP48EP

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MC33FS4501CAE Details

  • Manufacturer Part Number:

    MC33FS4501CAE

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    LQFP-48

  • Country Of Origin:

    Mainland China

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    10

  • JESD-30 Code:

    S-PQFP-G48

  • Length:

    7 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    48

  • Number of Transceivers:

    1

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HLFQFP

  • Package Equivalence Code:

    QFP48,.35SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1.6 mm

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    SMARTMOS

  • Telecom IC Type:

    CAN FD/LIN TRANSCEIVER

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    7 mm

MC33FS4501CAE Frequently Asked Questions (FAQs)

  • NXP provides a recommended PCB layout guide in the application note AN12085, which includes guidelines for component placement, routing, and thermal management to ensure optimal performance and minimize electromagnetic interference (EMI).
  • The MC33FS4501CAE has a programmable output voltage feature that can be configured using the I2C interface. The device has a set of registers that control the output voltage, and the configuration can be done using the NXP-provided software development kit (SDK) or by writing custom code to access the registers.
  • While the datasheet specifies a maximum input voltage of 5.5V, it's essential to note that the device can handle input voltage transients up to 6.5V for a short duration (typically 100ms). However, it's recommended to ensure that the input voltage remains within the specified range for reliable operation.
  • NXP provides guidelines for EMC compliance in the application note AN12085, which includes recommendations for PCB layout, component selection, and shielding. Additionally, the device has built-in features such as spread-spectrum clocking and slew-rate control to minimize EMI emissions.
  • The MC33FS4501CAE has a thermal pad on the bottom of the package that should be connected to a thermal ground plane on the PCB to dissipate heat efficiently. NXP recommends using thermal vias and a heat sink if necessary, depending on the application's thermal requirements.

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MC33FS4501CAE Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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