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MC33FS6500LAE - NXP

Description: Power Management Specialized - PMIC System Basis Chip, DCDC 0.8A Vcore CAN LIN, LQFP48EP

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Symbol
MC33FS6500LAE - NXP - PCB symbol
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PCB Footprints
MC33FS6500LAE - NXP PCB footprint - Quad Flat Packages - Quad Flat Packages - 48-pin LQFP-EP
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3D Models
MC33FS6500LAE - NXP - 3D model - Quad Flat Packages - 48-pin LQFP-EP
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MC33FS6500LAE Details

  • Manufacturer Part Number:

    MC33FS6500LAE

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    LQFP-48

  • Country Of Origin:

    Mainland China

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    10

  • JESD-30 Code:

    S-PQFP-G48

  • Length:

    7 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    48

  • Number of Transceivers:

    1

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HLFQFP

  • Package Equivalence Code:

    QFP48,.35SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1.6 mm

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    SMARTMOS

  • Telecom IC Type:

    CAN FD/LIN TRANSCEIVER

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    7 mm

MC33FS6500LAE Frequently Asked Questions (FAQs)

  • A good PCB layout for the MC33FS6500LAE involves keeping the analog and digital grounds separate, using a solid ground plane, and minimizing the length of the traces between the device and the power supply. NXP provides a recommended PCB layout in the device's application note.
  • To ensure proper configuration, refer to the device's datasheet and application notes, and consult with NXP's technical support team if necessary. Additionally, use NXP's configuration tools, such as the MC33FS6500LAE Configurator, to generate the correct configuration code for your specific application.
  • The MC33FS6500LAE has a maximum junction temperature of 150°C. To ensure safe operation, ensure good airflow around the device, use a heat sink if necessary, and monitor the device's temperature using the built-in thermal monitoring feature.
  • To troubleshoot issues with the MC33FS6500LAE, consult the device's datasheet and application notes, and use NXP's debugging tools, such as the MC33FS6500LAE Debugger. Additionally, check the device's error flags and status registers to identify the source of the issue.
  • Yes, the MC33FS6500LAE is a high-frequency device and requires proper EMI/EMC design considerations. Ensure proper shielding, use a common mode choke, and follow NXP's EMI/EMC guidelines to minimize electromagnetic interference.

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MC33FS6500LAE Overview

Use the download button to access the MC33FS6500LAE schematic symbol, PCB footprint, and 3D model.
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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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