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MC33FS6501CAER2 - NXP

Description: Power Management Specialised - PMIC System Basis Chip, DCDC 0.8A Vcore FS1B CAN, LQFP48EP

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Symbol
MC33FS6501CAER2 - NXP - PCB symbol
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PCB Footprints
MC33FS6501CAER2 - NXP PCB footprint - Quad Flat Packages - Quad Flat Packages - SOT1571-1-1
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3D Models
MC33FS6501CAER2 - NXP - 3D model - Quad Flat Packages - SOT1571-1-1
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MC33FS6501CAER2 Details

  • Manufacturer Part Number:

    MC33FS6501CAER2

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    LQFP-48

  • Country Of Origin:

    Mainland China

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    10

  • JESD-30 Code:

    S-PQFP-G48

  • Length:

    7 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    48

  • Number of Transceivers:

    1

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HLFQFP

  • Package Equivalence Code:

    QFP48,.35SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1.6 mm

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    SMARTMOS

  • Telecom IC Type:

    CAN FD/LIN TRANSCEIVER

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    7 mm

MC33FS6501CAER2 Frequently Asked Questions (FAQs)

  • NXP provides a recommended PCB layout in the application note AN12085, which includes guidelines for component placement, routing, and thermal management to ensure optimal performance and reliability.
  • The MC33FS6501CAER2 can be configured for different operating modes using the SPI interface. NXP provides a detailed description of the configuration registers and commands in the datasheet and application notes. Additionally, NXP's FS6501 Configuration Tool can be used to simplify the configuration process.
  • The maximum current rating for the MC33FS6501CAER2 is 2.5A per channel, but this can be limited by the thermal performance of the PCB and the surrounding environment. NXP recommends following the thermal design guidelines in the application note AN12085 to ensure reliable operation.
  • NXP provides a troubleshooting guide in the application note AN12085, which includes common issues and their solutions. Additionally, NXP's technical support team can be contacted for further assistance.
  • Yes, the MC33FS6501CAER2 is designed to work with other NXP devices, such as microcontrollers and power management ICs. NXP provides a range of compatible devices and development boards that can be used to build complete systems.

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MC33FS6501CAER2 Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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