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MC33FS6502LAE - NXP

Description: Power Management Specialized - PMIC System Basis Chip, DCDC 0.8A Vcore LDT CAN LIN, LQFP48EP

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Symbol
MC33FS6502LAE - NXP - PCB symbol
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PCB Footprints
MC33FS6502LAE - NXP PCB footprint - Quad Flat Packages - Quad Flat Packages - 48-pin LQFP-EP
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3D Models
MC33FS6502LAE - NXP - 3D model - Quad Flat Packages - 48-pin LQFP-EP
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MC33FS6502LAE Details

  • Manufacturer Part Number:

    MC33FS6502LAE

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    LQFP-48

  • Country Of Origin:

    Mainland China

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    10

  • JESD-30 Code:

    S-PQFP-G48

  • Length:

    7 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    48

  • Number of Transceivers:

    1

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HLFQFP

  • Package Equivalence Code:

    QFP48,.35SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1.6 mm

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    SMARTMOS

  • Telecom IC Type:

    CAN FD/LIN TRANSCEIVER

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    7 mm

MC33FS6502LAE Frequently Asked Questions (FAQs)

  • A good PCB layout for the MC33FS6502LAE involves keeping the analog and digital grounds separate, using a solid ground plane, and minimizing the length of the traces between the device and the power supply. Additionally, it's recommended to use a 4-layer PCB with a dedicated power plane and a dedicated ground plane.
  • To ensure proper configuration, carefully review the datasheet and application notes, and consult with NXP's technical support team if necessary. Additionally, use NXP's configuration tools and software development kits (SDKs) to simplify the configuration process.
  • The MC33FS6502LAE has a maximum junction temperature of 150°C. To ensure reliable operation, ensure good thermal conductivity between the device and the PCB, use thermal vias, and consider using a heat sink or thermal interface material if necessary.
  • To troubleshoot issues, start by reviewing the datasheet and application notes, and checking the device's configuration and setup. Use debugging tools and software development kits (SDKs) to analyze the device's behavior and identify the root cause of the issue. Consult with NXP's technical support team if necessary.
  • To ensure EMI and EMC compliance, follow proper PCB layout and design guidelines, use shielding and filtering techniques, and consider using EMI-absorbing materials. Additionally, consult with NXP's technical support team and regulatory experts to ensure compliance with relevant standards and regulations.

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MC33FS6502LAE Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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