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MC33FS6504LAE - NXP

Description: Power Management Specialized - PMIC System Basis Chip, DCDC 0.8A Vcore LDT CAN LIN Vkam, LQFP48EP

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MC33FS6504LAE - NXP - PCB symbol
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PCB Footprints
MC33FS6504LAE - NXP PCB footprint - Quad Flat Packages - Quad Flat Packages - SOT1571-1-2
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3D Models
MC33FS6504LAE - NXP - 3D model - Quad Flat Packages - SOT1571-1-2
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MC33FS6504LAE Details

  • Manufacturer Part Number:

    MC33FS6504LAE

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    LQFP-48

  • Country Of Origin:

    Mainland China

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    10

  • JESD-30 Code:

    S-PQFP-G48

  • Length:

    7 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    48

  • Number of Transceivers:

    1

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HLFQFP

  • Package Equivalence Code:

    QFP48,.35SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1.6 mm

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    SMARTMOS

  • Telecom IC Type:

    CAN FD/LIN TRANSCEIVER

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    7 mm

MC33FS6504LAE Frequently Asked Questions (FAQs)

  • NXP provides a recommended PCB layout guide in the application note AN12085, which includes guidelines for component placement, routing, and thermal management to ensure optimal performance and minimize electromagnetic interference (EMI).
  • The MC33FS6504LAE has multiple power modes, including low-power mode, shutdown mode, and sleep mode. Configuration is done through the device's registers, which can be accessed through the I2C interface. Refer to the device's programming guide and register map for specific configuration details.
  • The maximum current rating for the device's output pins is 10mA per pin, with a total current limit of 50mA for all output pins combined. Exceeding these limits may cause damage to the device or affect its reliability.
  • Common issues with the I2C interface include bus contention, clock stretching, and incorrect slave addressing. Use a logic analyzer or oscilloscope to debug the I2C bus signals, and refer to the I2C specification and device datasheet for troubleshooting guidelines.
  • The MC33FS6504LAE is rated for operation from -40°C to 105°C (junction temperature). However, the device's performance and reliability may be affected at extreme temperatures, so it's essential to ensure proper thermal management and cooling in the system design.

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MC33FS6504LAE Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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