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MC33FS6510CAE - NXP

Description: Power Management Specialized - PMIC System Basis Chip, DCDC 1.5A Vcore CAN, LQFP48EP

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Symbol
MC33FS6510CAE - NXP - PCB symbol
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PCB Footprints
MC33FS6510CAE - NXP PCB footprint - Quad Flat Packages - Quad Flat Packages - 48-pin LQFP-EP
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3D Models
MC33FS6510CAE - NXP - 3D model - Quad Flat Packages - 48-pin LQFP-EP
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MC33FS6510CAE Details

  • Manufacturer Part Number:

    MC33FS6510CAE

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    LQFP-48

  • Country Of Origin:

    Mainland China

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    10

  • JESD-30 Code:

    S-PQFP-G48

  • JESD-609 Code:

    e3

  • Length:

    7 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    48

  • Number of Transceivers:

    1

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HLFQFP

  • Package Equivalence Code:

    QFP48,.35SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1.6 mm

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    SMARTMOS

  • Telecom IC Type:

    CAN FD/LIN TRANSCEIVER

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    7 mm

MC33FS6510CAE Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the analog and digital sections separate, and use a common ground point for the analog and digital grounds. Refer to the NXP application note AN12085 for more details.
  • The MC33FS6510CAE has a low-power mode that can be enabled by setting the EN pin low. Additionally, the device can be configured to enter a low-power state by setting the appropriate registers. Refer to the datasheet section 10.3 for more details.
  • The MC33FS6510CAE can deliver up to 1.5A of current. However, the maximum current delivery is dependent on the input voltage, output voltage, and the device's thermal performance.
  • Use a logic analyzer or oscilloscope to monitor the device's pins and verify that the input and output voltages are within the specified ranges. Check the device's thermal performance and ensure that the PCB layout is correct. Refer to the datasheet section 11 for troubleshooting guidelines.
  • The MC33FS6510CAE is rated for operation up to 125°C. However, the device's performance and reliability may be affected at high temperatures. Ensure that the device is properly heatsinked and that the thermal design is adequate for the application.

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MC33FS6510CAE Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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