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MC33FS6512CAE - NXP

Description: Power Management Specialized - PMIC System Basis Chip, DCDC 1.5A Vcore LDT CAN, LQFP48EP

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Symbol
MC33FS6512CAE - NXP - PCB symbol
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PCB Footprints
MC33FS6512CAE - NXP PCB footprint - Quad Flat Packages - Quad Flat Packages - SOT1571-1
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3D Models
MC33FS6512CAE - NXP - 3D model - Quad Flat Packages - SOT1571-1
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MC33FS6512CAE Details

  • Manufacturer Part Number:

    MC33FS6512CAE

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    LQFP-48

  • Country Of Origin:

    Mainland China

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    10

  • JESD-30 Code:

    S-PQFP-G48

  • Length:

    7 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    48

  • Number of Transceivers:

    1

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HLFQFP

  • Package Equivalence Code:

    QFP48,.35SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1.6 mm

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    SMARTMOS

  • Telecom IC Type:

    CAN FD/LIN TRANSCEIVER

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    7 mm

MC33FS6512CAE Frequently Asked Questions (FAQs)

  • NXP provides a recommended PCB layout guide in the application note AN12085, which includes guidelines for component placement, routing, and thermal management to ensure optimal performance and minimize electromagnetic interference (EMI).
  • The MC33FS6512CAE has multiple operating modes, including buck, boost, and buck-boost modes. Configuration is done through the device's registers, which can be accessed through the I2C interface. NXP provides a detailed register map and configuration guide in the device's datasheet and application notes.
  • While the datasheet specifies a maximum input voltage of 18V, it's essential to consider the device's absolute maximum ratings, which include a maximum input voltage of 20V. However, operating the device at this voltage may reduce its reliability and lifespan.
  • To ensure EMC compliance, follow NXP's guidelines for PCB layout, component selection, and shielding. Additionally, consider using EMI filters, such as common-mode chokes and capacitors, to reduce electromagnetic radiation. NXP provides EMC compliance guidelines in the device's datasheet and application notes.
  • The MC33FS6512CAE has a maximum power dissipation of 3.5W. To manage thermal dissipation, use a thermal pad on the device's exposed pad, and ensure good thermal conductivity between the device and the PCB. NXP provides thermal management guidelines in the device's datasheet and application notes.

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MC33FS6512CAE Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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