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MC33FS6522LAE - NXP

Description: NXP - MC33FS6522LAE - System Basis Chip, CAN, LIN Protocol, ISO 11898-2/5, LIN 2.0/2.1/2.2, SAE J2602, HLQFP-48

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Symbol
MC33FS6522LAE - NXP - PCB symbol
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PCB Footprints
MC33FS6522LAE - NXP PCB footprint - Quad Flat Packages - Quad Flat Packages - 48 LEAD LQFP
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3D Models
MC33FS6522LAE - NXP - 3D model - Quad Flat Packages - 48 LEAD LQFP
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MC33FS6522LAE Details

  • Manufacturer Part Number:

    MC33FS6522LAE

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    LQFP-48

  • Country Of Origin:

    Mainland China

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    10

  • JESD-30 Code:

    S-PQFP-G48

  • Length:

    7 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    48

  • Number of Transceivers:

    1

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HLFQFP

  • Package Equivalence Code:

    QFP48,.35SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1.6 mm

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    SMARTMOS

  • Telecom IC Type:

    CAN FD/LIN TRANSCEIVER

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    7 mm

MC33FS6522LAE Frequently Asked Questions (FAQs)

  • A good PCB layout for the MC33FS6522LAE involves keeping the analog and digital grounds separate, using a solid ground plane, and placing the device close to the power source. Additionally, it's recommended to use a 4-layer PCB with a dedicated power plane and a dedicated ground plane.
  • To configure the MC33FS6522LAE for low-power mode, set the EN pin low, and ensure that the device is in a stable state before entering low-power mode. Also, make sure to disable the internal regulators and turn off the clock before entering low-power mode.
  • The MC33FS6522LAE can deliver up to 2A of current, but it's recommended to limit the current to 1.5A for optimal performance and to prevent overheating.
  • To troubleshoot issues with the MC33FS6522LAE, start by checking the power supply voltage, ensuring that it's within the recommended range. Then, check the device's configuration and settings, and verify that the device is properly connected to the PCB. If the issue persists, try resetting the device or checking for any firmware updates.
  • Yes, the MC33FS6522LAE is compatible with other NXP Semiconductors devices, including microcontrollers, sensors, and other power management ICs. However, it's recommended to verify compatibility and ensure that the devices are configured correctly for optimal performance.

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MC33FS6522LAE Overview

Use the download button to access the MC33FS6522LAE schematic symbol, PCB footprint, and 3D model.
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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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